Coating device and nozzle managing method

ABSTRACT

A coating device including a coating mechanism which includes nozzles for ejecting a liquid material onto front and rear surfaces of the substrate while rotating a substrate in an upright state, and a nozzle managing mechanism which manages the state of the nozzles, in which the nozzle managing mechanism includes a soaking portion which dips the front end of the nozzle in a soak solution, and a discharging portion which discharges at least the soak solution, and a nozzle managing method.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a coating device and a nozzle managingmethod.

Priority claimed on Japanese Patent Application No. 2009-160041, filedon Jul. 6, 2009, and Japanese Patent Application No. 2010-140953, filedon Jun. 21, 2010, the contents of which are incorporated herein byreference.

2. Description of the Related Art

For example, upon coating a thin film such as a resist film on varioussubstrates such as a semiconductor substrate, a glass substrate forminga liquid crystal panel, and a substrate forming a hard disk, a coatingdevice is used to form the coating film on the substrate while rotatingthe substrate. In the coating device, in general, the substrate is laiddown so as to be parallel to a horizontal plane and the substrate isrotated while the lower substrate surface is held.

Meanwhile, in the substrate used to form the hard disk, for example, itis necessary to coat the liquid material on both surfaces thereof. Inthe case of this kind of substrate in which both surfaces are requiredto be coated with the liquid material, it is not possible to hold thelower substrate surface. For this reason, Patent Reference 1, forexample, discloses a technology in which the substrate is rotated whilethe substrate is held by a holding piece.

In the case where the liquid material is coated on both surfaces of thesubstrate when the substrate is laid down, the coating conditionsbetween the top and bottom surfaces of the substrate are different. Forthis reason, the state of the thin film formed on the top surface of thesubstrate may be different from the state of the thin film formed on thebottom surface thereof. To the contrary, there has recently beenproposed a technology in which the liquid material is simultaneouslycoated on both surfaces of the substrate in an upright (i.e. vertical)state.

Patent Reference 1

-   Japanese Unexamined Patent Application, First Publication No. Hei    7-130642

BRIEF SUMMARY OF THE INVENTION

It is required that the liquid material on the substrate be in asatisfactory coating state when the liquid material is coated on thesubstrate.

For this reason, it is necessary to manage a nozzle while performing acoating process. In the case where the liquid material is coated on thesubstrate in an upright state, a ejecting direction of the nozzle isdifferent from that in conventional technology, it is required toreliably manage the nozzle.

SUMMARY OF THE INVENTION

In consideration of the above-described circumstance, an object of theinvention is to provide a coating device and a nozzle managing method,which are capable of improving the management state of the nozzle.

A coating device according to a first aspect of the invention includes acoating mechanism which includes nozzles for ejecting a liquid materialonto front and rear surfaces of the substrate while rotating a substratein an upright state; and a nozzle managing mechanism which manages thestate of the nozzles; wherein the nozzle managing mechanism includes asoaking portion which dips the front end of the nozzle in a soaksolution; and a discharging portion which discharges at least the soaksolution.

According to the first aspect of the invention, since the coating deviceincludes the soaking portion that dips the front end of the nozzle inthe soak solution, it is possible to prevent the front end of the nozzlefrom drying out. For this reason, it is possible to prevent the liquidmaterial from becoming solidified on the front end of the nozzle, whichmakes it possible to avoid blockage in the nozzle or an insufficientejection rate of the liquid material. In addition, according to thepresent invention, since it is possible to discharge the soak solutionas needed, it is possible to prevent the impurities from being adheredto the nozzle in the case where impurities are mixed into the soaksolution. Accordingly, it is possible to improve the management state ofthe nozzle.

In the coating device, the nozzle managing mechanism is preferablyprovided in the vicinity of the coating mechanism.

In this case, since the nozzle managing mechanism is provided in thevicinity of the coating mechanism, the nozzle managing mechanism isaccessed by the nozzle in a short period of time. Accordingly, it ispossible to suppress the time required for the management of the nozzle.

In the coating device, the coating device preferably includes a cupportion, and the nozzle managing mechanism is preferably mounted to thecup portion.

In this case, since the coating device includes the cup portion, and thenozzle managing mechanism is mounted to the cup portion, it is possiblefor the nozzle to access the nozzle managing mechanism in an extremelyshort period of time.

In the coating device, the discharging portion preferably includes aconnection portion to which the front end of the nozzle is connected.

In this case, since the discharging portion includes the connectionportion to which the front end of the nozzle is connected, it ispossible to connect the nozzle to the discharging portion. Accordingly,it is possible for the discharging portion to perform a preliminaryejecting operation of the liquid material.

In the coating device, the discharging portion preferably includes asuction portion.

In this case, since the discharging portion includes the suctionportion, it is possible to rapidly perform a discharging operation ofthe soak solution. Further, for example, it is possible to removeforeign objects or the like adhered to the front end of the nozzle bybringing the front end of the nozzle close to the suction portion.

In the coating device, the discharging portion is preferably provided soas to be adjacent to the soaking portion.

In this case, since the discharging portion is provided so as to beadjacent to the soaking portion, it is possible to efficiently dischargethe soak solution in the soaking portion. In addition, since it is easyto adjust the discharging rate of the soak solution from the dischargingportion, a wide range of discharging modes in which a soak solutionoverflowing from the soaking portion is discharged and the like may beadopted.

In the coating device, the nozzle managing mechanism preferably includesat least a movement restricting portion that restricts a movement of thenozzle in a state in which the nozzle is connected to the soakingportion.

In this case, since the nozzle managing mechanism includes at least themovement restricting portion that restricts a movement of the nozzle ina state in which the nozzle is connected to the soaking portion, it ispossible to prevent a deviation of the nozzle in an access state.

In the coating device, the movement restricting portion preferablyincludes a groove portion into which the front end of the nozzle isfitted.

In this case, since the movement restricting portion includes the grooveportion into which the front end of the nozzle is fitted, it is possibleto make an attempt to at least access the soaking portion, performpositioning of the nozzle at the time of accessing, and prevent apositional deviation by one operation that the nozzle is fitted into thegroove portion. Accordingly, it is possible to efficiently manage thenozzle.

In the coating device, the soaking portion preferably includes a soaksolution storage portion storing the soak solution. The soak solutionstorage portion is formed so as to become narrower gradually in thedepth direction.

In this case, since the soaking portion includes the soak solutionstorage portion storing the soak solution, and the soak solution storageportion is formed so as to become narrower gradually in the depthdirection, a movable width of the front end of the nozzle dipped in thesoak solution storage portion becomes smaller than the entrance of thesoak solution storage portion. Accordingly, it is possible to suppress adeviation of the front end of the nozzle in a state in which the frontend of the nozzle is dipped in the soak solution to a minimum.

In the coating device, the nozzle managing mechanism preferably includesa preliminary ejection portion that receives the liquid materialpreliminarily ejected from the nozzle, and the preliminary ejectionportion preferably includes a linear member that receives the liquidmaterial preliminarily ejected from the nozzle.

In this case, since the nozzle managing mechanism includes thepreliminary ejection portion that receives the liquid materialpreliminarily ejected from the nozzle, and the preliminary ejectionportion includes the linear member that receives the liquid materialpreliminarily ejected from the nozzle, the nozzle managing mechanism isconfigured to receive the liquid material, not on its planar surface,but on its linear surface. Accordingly, it is possible to reliablyreceive the liquid material regardless of an ejecting direction of theliquid material. Further, since it suffices to provide a linear membersmaller in volume than that of the planar portion for receiving liquidto the preliminary ejection portion, it is possible to suppress anincrease in size of the preliminary ejection portion.

In the coating device, the linear member is preferably disposed so as tointersect with the ejecting direction of the liquid material.

In this case, since the linear member is disposed so as to intersectwith the ejecting direction of the liquid material, it is possible tomore reliably receive the liquid material.

In the coating device, the linear member is preferably provided so as tobe capable of drawing back from the front end of the nozzle.

In this case, since the linear member is provided so as to be capable ofdrawing back from the front end of the nozzle, it is possible toflexibly change the state of the inside of the preliminary ejectionportion. Accordingly, the inside of the preliminary ejection portion maybe made into a state corresponding to a processing status of the nozzlemanagement.

In the coating device, the preliminary ejection portion preferablyincludes a second suction portion that suctions a surrounding space ofthe linear member.

In this case, since the preliminary ejection portion includes the secondsuction portion that suctions a surrounding space of the linear member,it is possible to remove the liquid material adhered to the linearmember from the surface of the linear member. Accordingly, it ispossible for the linear member to receive a new liquid material in astate in which the ability for receiving liquid is maintained.

A nozzle managing method according to a second aspect of the invention,in which nozzles eject a liquid material onto front and rear surfaces ofthe substrate while rotating a substrate in an upright state, includessoaking for dipping the front end of the nozzle in a soak solution; anddischarging of the soak solution.

According to the second aspect of the invention, since the front end ofthe nozzle is dipped in a soak solution, it is possible to prevent thefront end of the nozzle from drying out. For this reason, it is possibleto prevent the liquid material from solidifying on the front end of thenozzle, which makes it possible to avoid blockage of the nozzle or aninsufficient ejection rate of the liquid material. In addition,according to the present invention, since the soak solution isdischarged as needed, it is possible to prevent the impurities fromadhering to the nozzle in the case where impurities are mixed into thesoak solution.

In the nozzle managing method, the soaking and the discharging arepreferably performed in the vicinity of the ejecting position of theliquid material with respect to the substrate.

In this case, since the soaking and the discharging are performed in thevicinity of the ejecting position of the liquid material with respect tothe substrate, it is possible to switch an ejecting process, a soakingprocess, and a discharging process of the liquid material with respectto the substrate in a short period of time.

In the nozzle managing method, at least the soaking is preferablyperformed while restricting the movement of the nozzle.

In this case, since at least the soaking process is performed whilerestricting the movement of the nozzle, it is possible to stabilize theposition of the front end of the nozzle. Accordingly, it is possible toreliably dip the front end of the nozzle into the soak solution.

The nozzle managing method preferably further includes preliminaryejecting of the liquid material from the front end of the nozzle.

In this case, since the nozzle managing method includes the preliminaryejecting process of preliminarily ejecting the liquid material from thefront end of the nozzle, it is possible to stabilize the ejecting stateof the nozzle.

In the nozzle managing method, the preliminary ejecting preferablypreliminary ejects the liquid material into a discharge path in thedischarging.

In this case, since the preliminary ejecting preliminary ejects theliquid material into the discharge path in the discharging, it ispossible to make an attempt to save the space, and to unify themanagement of the discharge path.

In the nozzle managing method, the preliminary ejecting processpreferably preliminary ejects the liquid material toward the soaksolution.

In this case, since the preliminary ejecting process preliminary ejectsthe liquid material toward the soak solution, it is possible to shortenthe time from the soaking to the preliminary ejecting. Accordingly, itis possible to efficiently perform management of the nozzle.

In the nozzle managing method, the liquid material is used as a soaksolution.

In this case, since the liquid material is used as a soak solution, itis possible to unify the types of liquids discharged from thedischarging portion. Accordingly, it is possible to reduce the burdenrequired for management of discharge liquid.

In the nozzle managing method, the preliminary ejecting preferablyincludes suctioning of the front end of the nozzle.

In this case, since the preliminary ejecting includes the suctioning ofthe front end of the nozzle, it is possible to remove foreign objects orthe like adhered to the front end of the nozzle. Accordingly, it ispossible to keep the front end of the nozzle clean.

In the nozzle managing method, the preliminary ejecting preferablyreceives the liquid material preliminarily ejected from the nozzle byuse of a linear member.

In this case, since the preliminary ejecting receives the liquidmaterial preliminarily ejected from the nozzle by use of the linearmember, the preliminary ejecting receives the liquid material, not onits planar surface, but with its line. Accordingly, it is possible toreliably receive the liquid material regardless of the ejectingdirection of the liquid material. Further, since it suffices to providea space smaller than that in the case of using the plane for receivingliquid, it is possible to suppress an increase in the size of thepreliminary ejection portion.

In the nozzle managing method, the preliminary ejecting is preferablyperformed in a state in which the linear member is made to intersectwith the ejecting direction of the liquid material.

In this case, since the preliminary ejecting is performed in a state inwhich the linear member is made to intersect with the ejecting directionof the liquid material, it is possible to more reliably receive theliquid material.

In the nozzle managing method, the preliminary ejecting preferablyincludes a second suction of suctioning a surrounding space of thelinear member.

In this case, since the surrounding space of the linear member issuctioned in the preliminary ejecting, it is possible to remove theliquid material adhered to the linear member from the surface of thelinear member. Accordingly, it is possible for the linear member toreceive a new liquid material in a state in which the ability forreceiving liquid is maintained.

According to the present invention, it is possible to provide a coatingdevice and a nozzle managing method, which are capable of improving themanagement state of the nozzle.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a plan view showing the constitution of a substrate processingsystem according to the embodiment of the invention.

FIG. 2 is a front view showing the constitution of a substrateprocessing system according to the embodiment of the invention.

FIG. 3 is a side view showing the constitution of a substrate processingsystem according to the embodiment of the invention.

FIG. 4 is a view showing the constitution of a substrate loadingmechanism and a substrate unloading mechanism.

FIG. 5 is a view showing the constitution of the substrate loadingmechanism and the substrate unloading mechanism.

FIG. 6 is a view showing the constitution of the substrate loadingmechanism and the substrate unloading mechanism.

FIG. 7 is a view showing the constitution of a holding portion.

FIG. 8 is a front view showing the constitution of a substrateprocessing unit.

FIG. 9 is a side view showing the constitution of a substrate processingunit.

FIG. 10 is a plan view showing the constitution of a substrateprocessing unit.

FIG. 11 is a view showing the constitution of a front end of a nozzle.

FIG. 12 is a view showing the constitution of an inner cup.

FIG. 13 is a view showing the constitution of a nozzle managingmechanism.

FIG. 14 is a view showing the constitution of the nozzle managingmechanism.

FIGS. 15A, 15B, and 15C are views showing operations of the nozzlemanaging mechanism.

FIG. 16 is a view showing another constitution of a cassette movingmechanism.

FIG. 17 is a view showing another constitution of the cassette movingmechanism.

FIG. 18 is a view showing a partial constitution of the cassette movingmechanism.

FIG. 19 is a view showing another constitution of the cassette movingmechanism.

DETAILED DESCRIPTION OF THE INVENTION

An embodiment of the invention will be described with reference to theaccompanying drawings.

FIG. 1 is a plan view showing a schematic constitution of a substrateprocessing system SYS according to the embodiment of the invention. FIG.2 is a front view showing the schematic constitution of the substrateprocessing system SYS. FIG. 3 is a side view showing the schematicconstitution of the substrate processing system SYS.

In the embodiment, when describing the constitution of the substrateprocessing system SYS, for the purpose of simple markings, an XYZcoordinate system is used to describe the directions in the drawings. Inthe XYZ coordinate system, the horizontal direction in the drawing ismarked as the X direction, and the direction perpendicular to the Xdirection in plan view is marked as the Y direction. The directionperpendicular to a plane including the X and Y axes is marked as the Zdirection. In the X, Y, and Z directions, the arrow direction in thedrawing is the +direction, and the opposite direction of the arrowdirection is the −direction.

As shown in FIGS. 1 to 3, the substrate processing system SYS is asystem which is incorporated into, for example, a manufacturing line ofa factory or the like and forms a thin film on a predetermined area of asubstrate S. The substrate processing system SYS includes a stage unitSTU, a substrate processing unit (coating device) SPU, a substrateloading unit LDU, a substrate unloading unit ULU, a carrying unit CRU,and a control unit CNU.

In the substrate processing system SYS, the stage unit STU is supportedon a floor surface through, for example, a bridge member or the like.The substrate processing unit SPU, the substrate loading unit LDU, thesubstrate unloading unit ULU, and the carrying unit CRU are disposed onthe upper surface of the stage unit STU. Inside each of the substrateprocessing unit SPU, the substrate loading unit LDU, the substrateunloading unit ULU, and the carrying unit CRU is covered by a covermember. In the substrate processing system SYS, the substrate processingunit SPU, the substrate loading unit LDU, and the substrate unloadingunit ULU are arranged in a linear shape along the X direction. Thesubstrate processing unit SPU is disposed between the substrate loadingunit LDU and the substrate unloading unit ULU. In a portion of the stageunit STU where the substrate processing unit SPU is disposed, a centerthereof in plan view is recessed in the −Z direction relative to otherportions.

As the substrate S as a processing object of the substrate processingsystem SYS according to the embodiment, for example, a semiconductorsubstrate such as silicon, a glass substrate forming a liquid crystalpanel, a substrate forming a hard disk, and the like may be exemplified.In the embodiment, as the substrate S, a substrate which forms a harddisk is an exemplary example. The substrate is formed of glass, and isformed as a disk-shaped base, a surface of which is coated with diamondand in the center of which in plan view an opening is formed.

A loading operation and an unloading operation of the substrate S in thesubstrate processing system SYS according to the embodiment areperformed by a cassette C capable of accommodating a plurality of sheetsof the substrates S. The cassette C is a container formed in a squareshape, and is capable of accommodating a plurality of sheets ofsubstrates S in series so that the substrate surfaces face each other.Accordingly, the cassette C is configured to accommodate the substratesS in the state where the substrates S are erect in the Z direction. Thecassette C has an opening formed in a bottom portion thereof. Each ofthe substrates S is accommodated so as to protrude from the bottomportion of the cassette C through the opening. The cassette C is formedin a rectangular shape in plan view, and has, for example, an engagementportion Cx formed in the +Z direction side edge portion as shown in FIG.2. In the embodiment, as the cassette C, two types of cassettes, thatis, a loading cassette C1 for loading the substrate S and an unloadingcassette C2 for unloading the substrate S are used. The loading cassetteC1 accommodates only the unprocessed substrate S, and the unloadingcassette C2 accommodates only the processed substrate S. The loadingcassette C1 is used between the substrate processing unit SPU and thesubstrate loading unit LDU. The unloading cassette C2 is used betweenthe substrate processing unit SPU and the substrate unloading unit ULU.Accordingly, the loading cassette C1 and the unloading cassette C2 arenot used together. The loading cassette C1 and the unloading cassette C2are formed to have, for example, the same shape and size.

Substrate Loading Unit

The substrate loading unit LDU is disposed on the −X direction side ofthe substrate processing system SYS. The substrate loading unit LDU is aunit which receives the loading cassette C1 accommodating theunprocessed substrate S, and collects the empty loading cassette C1. Thesubstrate loading unit LDU is elongated in the Y direction, and iscapable of accommodating a plurality of loading cassettes C1 arranged inthe Y direction in a standby state.

The substrate loading unit LDU includes a cassette entrance 10 and acassette moving mechanism (second moving mechanism) 11. The cassetteentrance 10 is an opening which is provided in the −Y direction side ofthe cover member covering the substrate loading unit LDU. The cassetteentrance 10 is an inlet (supply opening) for the loading cassette C1accommodating the unprocessed substrates S, and an outlet (collectionopening) for the empty loading cassette C1.

The cassette moving mechanism 11 includes, for example, a drivingmechanism such as a belt conveyor mechanism. In the embodiment, as thedriving mechanism, conveyor belts (a supply belt 11 a and a collectionbelt 11 b) are provided. The conveyor belts extend in the Y directionfrom the +Y direction side end portion of the substrate loading unit LDUto the −Y direction side end portion thereof, where two conveyor beltsextend in the X direction.

Among the two conveyor belts, the supply belt 11 a is a conveyor beltwhich is disposed on the +X direction side. The +Z direction sidesurface of the supply belt 11 a is used as a conveyor surface. Thesupply belt 11 a is configured to rotate so that the conveyor surfacemoves in the −Y direction. A plurality of loading cassettes C1, whichenter the substrate loading unit LDU through the cassette entrance 10,are placed on the conveyor surface of the supply belt 11 a. Theplurality of loading cassettes C1 are moved to the carrying unit CRU byrotation of the supply belt 11 a.

Among two conveyor belts, the collection belt 11 b is a conveyor beltwhich is disposed on the +X direction side. The +Z direction sidesurface of the collection belt 11 b is used as a conveyor surface. Thecollection belt 11 b is configured to rotate so that the conveyorsurface moves in the −Y direction. The plurality of empty loadingcassettes C1 are placed on the conveyor surface of the collection belt11 b. The loading cassettes C1 are made to move to the cassette entrance10 by rotation of the collection belt 11 b.

In the embodiment, for example, the loading cassettes C1 are capable ofstaying in a standby state at standby positions (container standbyportion) provided at five positions on the supply belt 11 a and thecollection belt 11 b. In the substrate loading unit LDU, it is possibleto move the standby position of the loading cassettes C1 by rotating thesupply belt 11 a and the collection belt 11 b. It is possible to shortenthe carrying time of the loading cassette C1 by moving the standbyposition.

Substrate Processing Unit

The substrate processing unit SPU is disposed in the substrateprocessing system SYS so as to be substantially located at the center inthe X direction. The substrate processing unit SPU is a unit whichperforms various processes such as a process of coating a liquidmaterial such as resist on the substrate S so as to form a thin filmthereon and a process of removing the thin film formed on the peripheralportion of the substrate S. The substrate processing unit SPU includes abuffer mechanism BF, a substrate carrying mechanism (rotary mechanism)SC, a coating mechanism CT, and a peripheral edge removing mechanism(adjusting portion) EBR.

The buffer mechanisms BF are respectively provided at two positionsalong the +Y direction side edge of the substrate processing unit SPUwith the coating mechanism CT interposed therebetween in the Xdirection. Among the buffer mechanisms BF at two positions, the buffermechanism disposed on the −X direction side of the coating mechanism CTis a loading buffer mechanism (substrate loading area) BF1, and thebuffer mechanism disposed on the +X direction side of the coatingmechanism CT is an unloading buffer mechanism (substrate unloading area)BF2.

The loading buffer mechanism BF1 is a portion where the loading cassetteC1 supplied to the substrate processing unit SPU stays in a standbystate. The loading buffer mechanism BF1 is provided with a cassettemoving mechanism (third moving mechanism) 20. The cassette movingmechanism 20 includes, for example, a driving mechanism such as aconveyor mechanism. In the embodiment, as the driving mechanism, twoconveyor belts 20 a and 20 b are provided.

The conveyor belt 20 a is provided in an area in the X direction of theloading buffer mechanism BF1. The +Z direction side surface of theconveyor belt 20 a is used as a conveyor surface, and the suppliedloading cassette C1 is placed on the conveyor surface. The conveyor belt20 a is adapted to rotate so that the conveyor surface moves in Xdirection. It is possible to move the loading cassette C1 in the Xdirection of the loading buffer mechanism BF1 by rotating the conveyorbelt 20 a. The conveyor belt 20 b is provided at the center in the Xdirection of the loading buffer mechanism BF1. The +Z direction sidesurface of the conveyor belt 20 b is used as a conveyor surface, and theloading cassette C1 is placed on the conveyor surface. The conveyor belt20 b is adapted to rotate so that the conveyor surface moves in the Ydirection. By the rotation of the conveyor belt 20 b, the loadingcassette C1 moves in the Y direction. In this manner, the cassettemoving mechanism 20 moves the standby position of the loading cassetteC1.

In the loading buffer mechanism BF1, plural, for example, three, loadingcassettes C1 are arranged in the X direction of the formation area ofthe conveyor belt 20 a so as to stay in a standby state (secondcontainer standby portion). The standby position P1 on the −X directionside of the drawing is, for example, a standby position for the loadingcassette C1 supplied to the substrate processing unit SPU. The standbyposition P2 at the center in the X direction of the drawing is a standbyposition for the loading cassette C1 moving from the standby positionP1. The standby position P3 on the +X direction side of the drawing is astandby position for the loading cassette C1 moving from the standbyposition P2.

The +Y direction side end portion of the conveyor belt 20 b is disposedinside the standby position P2. For this reason, the loading cassette C1disposed at the standby position P2 moves in the −Y direction siderelative to the standby position P2 by the conveyor belt 20 b, and staysat the standby position P4 in a standby state. A loading position LP forthe substrate S is provided on the +Z direction side of the standbyposition P4. The substrate S is carried to the coating mechanism CTthrough the loading position LP.

The unloading buffer mechanism BF2 is a portion of the substrateprocessing unit SPU where the unloading cassette C2 supplied to thesubstrate processing unit SPU stays in a standby state. The unloadingbuffer mechanism BF2 is provided with a cassette moving mechanism (thirdmoving mechanism) 22. The cassette moving mechanism 22 includes, forexample, a driving mechanism such as a belt conveyor. In the embodiment,as in the loading buffer mechanism BF1, two conveyor belts 22 a and 22 bare provided as the driving mechanism.

The conveyor belt 22 a is provided in an area in the X direction of theunloading buffer mechanism BF2. The +Z direction side surface of theconveyor belt 22 a is used as a conveyor surface, and the suppliedunloading cassette C2 is placed on the conveyor surface. The conveyorbelt 22 a is adapted to rotate so that the conveyor surface moves in theX direction. It is possible to move the unloading cassette C2 in the Xdirection of the unloading buffer mechanism BF2 by rotating of theconveyor belt 22 a. The conveyor belt 22 b is provided at the center inthe X direction of the unloading buffer mechanism BF2. As in theconveyor belt 20 b, the +Z direction side surface of the conveyor belt22 b is used as a conveyor surface, and the unloading cassette C2 isplaced on the conveyor surface. The conveyor belt 22 b is adapted torotate so that the conveyor surface moves in the Y direction. By therotation of the conveyor belt 22 b, the unloading cassette C2 moves inthe Y direction. In this manner, the cassette moving mechanism 22 movesthe standby position of the unloading cassette C2.

In the unloading buffer mechanism BF2, plural, for example, three,unloading cassettes C2 are arranged in the X direction on the conveyorbelt 22 a so as to stay in a standby state (second container standbyportion). The standby position P5 on the −X direction side of thedrawing is, for example, a standby position for the unloading cassetteC2 supplied to the substrate processing unit SPU. The standby positionP6 at the center in the X direction of the drawing is a standby positionfor the unloading cassette C2 moving from the standby position P5. Thestandby position P7 on the +X direction side of the drawing is a standbyposition for the unloading cassette C2 moving from the standby positionP6.

The +Y-direction-side end portion of the conveyor belt 22 b is disposedinside the standby position P6. For this reason, the unloading cassetteC2 disposed at the standby position P6 moves in the −Y direction siderelative to the standby position P6 by the conveyor belt 22 b, and staysat the standby position P8 in a standby state. An unloading position UPfor the substrate S is provided on the +Z direction side of the standbyposition P8. The substrate S is carried from the coating mechanism CT tothe unloading cassette C2 through the unloading position UP.

The substrate processing unit SPU includes a substrate loading mechanism21 and a substrate unloading mechanism 27 in the vicinity of the buffermechanism BF. The substrate loading mechanism 21 is disposed in thevicinity of the standby position P4. FIGS. 4 to 6 are viewsschematically showing a constitution of the substrate loading mechanism21.

As shown in the drawings, the substrate loading mechanism 21 includes asubstrate upper portion holding mechanism 23 and a substrate lowerportion holding mechanism 24. The substrate upper portion holdingmechanism 23 is disposed on the +X direction side of the standbyposition P4. The substrate upper portion holding mechanism 23 moves inthe Z direction while holding the +Z direction side portion of thesubstrate S. The substrate upper portion holding mechanism 23 includes araising and lowering member 23 a, a clamping member 23 b, and a raisingand lowering mechanism 23 c.

The raising and lowering member 23 a is a column member which is formedin an L-shape in side view and is movable in the Z direction. Theraising and lowering member 23 a includes a column portion which extendsin the Z direction and a protrusion which protrudes from the front endof the column portion in the X direction. Among them, the column portionis provided up to the +Z direction side of the +Z direction side endsurface of the loading cassette C1. The protrusion of the raising andlowering member 23 a is disposed at a position overlapping with theloading position LP in plan view. The −Z direction side portion of theprotrusion is provided with a concave portion matching the shape of thesubstrate S.

The clamping member 23 b is mounted to the concave portion of theraising and lowering member 23 a. Accordingly, the clamping member 23 bis provided at a position overlapping with the loading position LP inplan view. The raising and lowering mechanism 23 c is a driving portionwhich is mounted to the raising and lowering member 23 a, and isdisposed on the −Z direction side of the loading cassette C1. As theraising and lowering mechanism 23 c, for example, a driving mechanismsuch as an air cylinder may be used.

The substrate lower portion holding mechanism 24 is provided at aposition overlapping with the center of the loading position LP in planview. The substrate lower portion holding mechanism 24 moves in the Zdirection while holding the −Z direction side portion of the substrateS. The substrate lower portion holding mechanism 24 includes a raisingand lowering member 24 a, a clamping member 24 b, and a raising andlowering mechanism 24 c. The raising and lowering member 24 a is acolumn member which is formed in a bar shape and is movable in the Zdirection. The clamping member 24 b is mounted to the +Z direction sidefront end of the raising and lowering member 24 a. The clamping member24 b is disposed at a position overlapping with the center of theloading position LP in plan view. The raising and lowering mechanism 24c is a driving portion which is mounted to the raising and loweringmember 24 a, and is disposed on the −Z direction side of the loadingcassette C1. As the raising and lowering mechanism 24 c, for example, adriving mechanism such as an air cylinder may be used.

It is possible to separately operate the raising and lowering mechanism23 c of the substrate upper portion holding mechanism 23 and the raisingand lowering mechanism 24 c of the substrate lower portion holdingmechanism 24, and to operate them in an interlocking manner.

The substrate unloading mechanism 27 is disposed in the vicinity of thestandby position P8. The substrate unloading mechanism 27 has the sameconstitution as that of the substrate loading mechanism 21. In FIGS. 4to 6, the constituents (including the unloading position UP) of thesubstrate unloading mechanism 27 corresponding to the constituents(including the loading position LP) of the substrate loading mechanism21 are indicated by the parenthesized signs.

The substrate unloading mechanism 27 includes a substrate upper portionholding mechanism 25 and a substrate lower portion holding mechanism 26.The substrate upper portion holding mechanism 25 includes a raising andlowering member 25 a, a clamping member 25 b, and a raising and loweringmechanism 25 c. The substrate lower portion holding mechanism 26includes a raising and lowering member 26 a, a clamping member 26 b, anda raising and lowering mechanism 26 c. Since the positionalrelationship, the function, and the like of the respective constituentsof the substrate unloading mechanism 27 are the same as those of thecorresponding constituents of the substrate loading mechanism 21, thedescription thereof will be omitted.

The substrate carrying mechanisms SC are provided at two positions withthe coating mechanism CT interposed therebetween in the X direction soas to be located at the center in the Y direction of the substrateprocessing unit SPU. Among the substrate carrying mechanisms SC at twopositions, a device disposed on the −X direction side of the coatingmechanism CT is a loading carrying mechanism SC1, and a device disposedon the +X direction side of the coating mechanism CT is an unloadingcarrying device SC2. The loading carrying mechanism SC1, the unloadingcarrying mechanism SC2, and the coating mechanism CT are arranged in alinear shape in the X direction.

The loading carrying mechanism SC1 accesses the coating mechanism CT andthe loading position LP of the loading buffer mechanism BF1 so as tocarry the substrate S therebetween. FIG. 7 is a schematic view showing aconstitution of the loading carrying device. As shown in FIG. 7, theloading carrying mechanism SC1 includes a base portion 30, an armportion 31, and a holding portion 32.

The base portion 30 is provided on the upper surface of the recessedportion of the stage unit STU. The base 30 includes a fixed table 30 a,a rotary table 30 b, a rotary mechanism 30 c, and support members 30 d.

The fixed table 30 a is fixed to the upper surface of the recessedportion of the stage unit STU. The base portion 30 is fixed onto thestage unit STU through the fixed table 30 a so that no positionaldeviation occurs. The rotary table 30 b is disposed on the fixed table30 a through the rotary mechanism 30 c. The rotary table 30 b is adaptedto be rotatable about the Z axis serving as the rotary axis relative tothe fixed table 30 a. The rotary mechanism 30 c is a driving mechanismwhich is provided between the fixed table 30 a and the rotary table 30b, and applies the rotation force to the rotary table 30 b. Each of thesupport members 30 d is a column member of which the −Z direction sideend portion is fixed onto the rotary table 30 b. The support members 30d are provided at a plurality of positions, for example, two positionsof the rotary table 30 b. The +Z direction side end portion of thesupport member 30 d is inserted into the arm portion 31.

The arm portion 31 is supported by the support members 30 d of the baseportion 30. The arm portion 31 moves the holding portion 32 to differentpositions inside the substrate processing unit SPU. The arm portion 31includes a casing 31 a formed in a pentagonal column. A front endsurface 31 b of the casing 31 a is provided with an opening 31 c. Arotary mechanism 33, a suction mechanism 34, and a moving mechanism 35are provided inside the casing 31 a.

The rotary mechanism 33 is disposed on the +Z direction side inside thecasing 31 a. The rotary mechanism 33 includes a motor device 33 a and arotary shaft member 33 b. The motor device 33 a and the rotary shaftmember 33 b are adapted to be movable together in the horizontaldirection in the drawing. The motor device 33 a is a driving devicewhich applies the rotation force to the rotary shaft member 33 b. Therotary shaft member 33 b is a bar-shaped member which has a circularsection and is disposed parallel to the XY plane.

The rotary shaft member 33 b is adapted to be rotatable about the centerof the circle serving as the rotary axis by the driving force of themotor device 33 a. The rotary shaft member 33 b is disposed so that oneend thereof protrudes from the opening 31 c to the outside of the casing31 a (protrusion 33 c). The end surface of the rotary shaft member 33 bon the side of the protrusion 33 c is provided with a concave portion 33d used for mounting the holding portion 32 thereto. The concave portion33 d is formed in a circular shape in sectional view. The protrusion 33c includes a fixing mechanism which fixes the holding portion 32 in thestate where the holding portion 32 is mounted to the concave portion 33d. Since the holding portion 32 is fixed by the fixing mechanism, therotary shaft member 33 b and the holding portion 32 are adapted to bemovable together.

The rotary shaft member 33 b includes a perforation hole 33 e. Theperforation hole 33 e is formed so as to perforate a range from a bottomsurface 33 f of the concave portion 33 d of the rotary shaft member 33 bto an end surface 33 g on the other side of the rotary shaft member 33b. The bottom surface 33 f of the concave portion 33 d of the rotaryshaft member 33 b communicates with the end surface 33 g through theperforation hole 33 e.

The suction mechanism 34 is provided in the end surface 33 g of therotary shaft member 33 b. The suctioning means 34 includes a suctioningdevice such as a suction pump 34 a. The suction pump 34 a is connectedto the perforation hole 33 e of the end surface 33 g of the rotary shaftmember 33 b. The suction pump 34 a suctions the perforation hole 33 efrom the end surface 33 g of the rotary shaft member 33 b, therebysuctioning the holding portion 32 disposed on the bottom surface 33 f ofthe concave portion 33 d communicating with the perforation hole 33 e.

The moving mechanism 35 is disposed on the −Z direction side inside thecasing 31 a. The moving mechanism 35 includes a motor device 35 a, arotary shaft member 35 b, and a movable member 35 c. The motor device 35a is a driving device which applies the rotation force to the rotaryshaft member 35 b. The rotary shaft member 35 b is a bar-shaped memberwhich has a circular section and of which one end is inserted in themotor device 35 a. The rotary shaft member 35 b is adapted to berotatable about the center of the circle serving as the rotary axis bythe motor device 35 a. A screw thread (not shown) is formed on thesurface of the rotary shaft member 35 b.

The movable member 35 c includes a screw-connection portion 35 d and aconnection portion 35 e. The screw-connection portion 35 d is integrallyformed with the rotary shaft member 35 b, and has a screw thread (notshown) formed on the surface thereof. The connection portion 35 e isfixed to, for example, the motor device 33 a of the rotary mechanism 33.A screw thread is formed on the lower surface of the connection member35 e, and adapted to mesh with the screw thread formed in thescrew-connection portion 35 d.

When the motor device 35 a rotates the rotary shaft member 35 b, therotary shaft member 35 b and the screw-connection portion 35 d areadapted to rotate together. By rotation of the screw-connection portion35 d, the connection member 35 e meshing with the screw thread of thescrew-connection portion 35 d is adapted to move in the left or rightdirection in the drawing, and the connection member 35 e and the fixingmechanism 33 fixed to the connection member 35 e are adapted to movetogether in the left or right direction in the drawing. By means of themovement, the holding portion 32 provided in the right end of the rotarymechanism 33 in the drawing is adapted to move in the horizontaldirection in the drawing.

The holding portion 32 is separably fixed to the concave portion 33 d ofthe arm portion 31. The holding portion 32 holds, for example, thesubstrate S by using the holding force such as the absorption force. Theholding portion 32 includes a suction member 36 and a blocking member37. The suction member 36 and the blocking member 37 are separablyprovided.

The loading carrying mechanism SC1 with the above-described constitutionallows the holding portion 32 to access both the coating mechanism CTand the loading position LP in such a manner that the arm portion 31rotates about the Z axis serving as the rotary axis or moves in the XYplane. The loading carrying mechanism SC1 can hold the substrate S bythe suctioning force of the suction pump 34 a in the arm portion 31 soas to be upright in the Z direction, and it is possible to rotate thesubstrate S so as to be upright in the Z direction by rotating therotary shaft member 33 b in the arm portion 31. The state where thesubstrate is upright in the Z direction refers to the state where thesubstrate S is inclined with respect to a horizontal plane. In theembodiment, it is preferable to rotate the substrate by holding it in astate where the substrate is upright at an angle equal to or more than70° and equal to or less than 90° with respect to a horizontal plane.The rotary shaft members disposed in the arm portion 31 for rotating thesubstrate may have a constitution in which a plurality of shaft membersare connected through couplings.

Returning to FIGS. 1 to 3, the unloading carrying mechanism SC2 accessesthe coating mechanism CT, the unloading position UP of the unloadingbuffer mechanism BF2, and the peripheral edge removing mechanism EBR soas to carry the substrate S therebetween. The unloading carryingmechanism SC2 includes a base portion 40 (a fixed table 40 a and arotary table 40 b), an arm portion 41, and a holding portion 42. Sincethe constitution of the unloading carrying mechanism SC2 is the same asthat of the loading carrying mechanism SC1, the description of therespective constituents will be omitted. In FIG. 7, the constituents ofthe unloading carrying mechanism SC2 corresponding to the constituentsof the loading carrying mechanism SC1 are indicated by the parenthesizedsigns. Hereinafter, when mentioning the constituents of the unloadingcarrying mechanism SC2, the names of the corresponding constituents ofthe loading carrying mechanism SC1 are used, and the parenthesized signsin FIG. 7 are respectively added to the names.

The coating mechanism CT is substantially disposed at the center of thesubstrate processing unit SPU in plan view, and is fixed to the uppersurface of the recessed portion of the stage unit STU. The coatingmechanism CT is a device which coats a liquid material on the substrateS so as to form a thin film thereon. In the embodiment, the coatingmechanism CT forms a thin film, used to perform an imprinting process,on the substrate S. The access to the coating device CT is possible fromboth the −X direction side and +X direction side of the coatingmechanism CT. Accordingly, for example, the loading operation and theunloading operation of the substrate S are possible from both the −Xdirection side and the +X direction side. The coating device CT isconfigured to perform a coating process at a coating position (aposition depicted by the dashed line in the drawing) 50 substantiallypositioned in the center of the STU unit in the X direction. FIGS. 8 to10 are views showing a constitution of the coating mechanism CT. Thecoating mechanism CT includes a nozzle portion NZ, a cup portion CP, anda nozzle managing mechanism NM.

The nozzle portions NZ are provided so as to access the center in the Ydirection of the coating position 50 by using the nozzle movingmechanism 51. The nozzle portions NZ are respectively disposed on the +Xdirection side and the −X direction side of the coating position 50.Each nozzle portion NZ includes the nozzle 52 which ejects the liquidmaterial as a material forming the thin film onto the substrate S. Thenozzle 52 is formed by bending at the bent portion 52 b so as to ejectthe liquid material from the center of the substrate S to the outerperiphery thereof when the nozzle accesses the coating position. Thenozzle 52 is provided on the −Z direction side of the rotary axis of thesubstrate S. The nozzles 52 are disposed at the same positions of thefront surface (+X direction side) and the rear surface (−X directionside) of the substrate S relative to the coating position 50 so as to besymmetric to each other in the X direction. As shown in FIG. 11, theejecting surface 52 a of the front end of the nozzle 52 is inclinedrelative to the ejecting direction of the liquid material. Since thefront end of the nozzle 52 is sharp, for example, it is possible for theliquid material to neatly run out from the nozzle upon stopping thecoating operation using the liquid material.

The cup portion CP includes an inner cup CP1 and an outer cup CP2. Theinner cup CP1 is formed in a circular shape when viewed in the Xdirection, and is disposed so as to surround the side portion of thesubstrate S disposed at the coating position 50. The outer cup CP2 isformed in a square shape when viewed in the X direction, and supportsthe outside portion of the inner cup CP1. The outer cup CP2 is fixed tothe upper surface of the stage unit STU through, for example, a supportmember or the like. In the embodiment, the inner cup CP1 and the outercup CP2 are integrally formed with each other, but may, of course, beseparated from each other.

The inner cup CP1 includes an accommodation portion 53 whichaccommodates the liquid material. The accommodation portion 53 isprovided with the discharging mechanism 54 which discharges at least oneof the liquid material and gas inside the accommodation portion 53. Thedischarging mechanism 54 is provided along the tangential direction ofthe outer periphery of the inner cup CP1 formed in a circular shape.

As shown in FIG. 9, the discharging mechanism 54 is connected to anopening 53 d of the inner cup CP1 through flow paths such as pipingprovided in the outer cup CP2. In this way, the discharging mechanism 54is connected to the accommodation portion 53 of the inner cup CP1through the piping and the opening 53 d. In addition, the shape of theopening 53 d is not limited to a shape along the tangential direction ofthe inner cup CP1 as shown in FIG. 9. For example, the shape of theopening 53 d may be a shape along the radial direction of the inner cupCP1. In this case, for example, the discharging mechanism 54 may bedisposed in the four corners or in the center of the four sides of theouter cup CP2. As shown in FIG. 9, for example, the dischargingmechanism 54 is provided in each of four edges of the outer cup CP2,where the number of discharging mechanisms 54 is four in total. As shownin FIG. 9, each discharging mechanism 54 is connected to each dischargepath. Each discharge path is provided with the trap mechanism 55 whichis a gas-liquid separating mechanism for separating a gas and a liquid.In addition, the discharge path and the trap mechanism 55 for otherdischarge mechanisms 54 shown in FIGS. 8 to 10 are not shown in thedrawing.

As the inlet of the accommodation portion 53, the facing portion 53 a ofthe inner cup CP1 facing the side portion of the substrate S isseparably mounted to other portions of the inner cup CP1. As shown inFIG. 12, the inner cup CP1 includes the nozzle managing mechanism 53 bwhich adjusts the dimension of the opening of the facing portion 53 a.For example, it is possible to adjust the dimension of the opening byusing the nozzle managing mechanism 53 b in accordance with thethickness of the substrate S or the bouncing state of the coatingliquid. The −Y direction side portion of the nozzle 52 is provided withthe cleaning liquid nozzle portion 56 which ejects the cleaning liquidof the cup portion CP to the substrate S.

The nozzle managing mechanism NM manages the nozzle 52 so that theejecting state thereof is uniform.

The nozzle managing mechanism NM is mounted to the outer surface on the+X direction side of the cup portion CP.

FIG. 13 is a view showing a constitution of the nozzle managingmechanism NM when viewed in the −X direction. FIG. 14 is a view showinga constitution of the nozzle managing mechanism NM when viewed in the −Zdirection.

As shown in these drawings, the nozzle managing mechanism NM includes acasing BD, a soaking portion 57, a discharging portion 58, and apreliminary ejection portion 59. The soaking portion 57, the dischargingportion 58 and the preliminary ejection portion 59 are respectivelyformed in the casing BD, and those are integrally formed.

The soaking portion 57 dips the front end of the nozzle 52 in a soaksolution, which makes it possible to prevent the front end of the nozzle52 from drying out. For example, a cleaning liquid or the like that is aliquid material is used as a soak solution. The casing BD has a grooveportion 57 a at a position corresponding to the soaking portion 57. Thegroove portion 57 a is for connecting the nozzle 52 to the soakingportion 57. In more detail, the groove portion 57 a is a portion forcausing the nozzle 52 to be fitted into the soaking portion 57. In astate in which the nozzle 52 is fitted into the groove portion 57 a, thefront end portion of the nozzle 52 accesses the soaking portion 57. Whenthe nozzle 52 is fitted into the groove portion 57 a, it is possible toprevent the nozzle 52 from being deviated, for example, in the Ydirection in accessing of the front end portion of the nozzle 52.

The soaking portion 57 has a soak solution storage portion 57 b. Thesoak solution storage portion 57 b is a portion that stores a soaksolution Q, and is formed so as to be tapered as going along the −Zdirection. The soak solution Q goes through a flow path 57 d from a soaksolution supplying portion 57 c provided on the +Y direction side of thesoak solution storage portion 57 b, to be supplied to the soak solutionstorage portion 57 b.

The discharging portion 58 is a portion for discharging the soaksolution. The discharging portion 58 is disposed on the −Y directionside of the soaking portion 57, to be communicated with the soakingportion 57. Since the discharging portion 58 is communicated with thesoaking portion 57, the soak solution overflowing from the soakingportion 57 is to be discharged, which makes it possible to keep the soaksolution in the soaking portion 57 constant. The casing BD has a grooveportion 58 a (connection portion) at a position corresponding to thedischarging portion 58. The groove portion 58 a is a portion into whichthe nozzle 52 is fitted. In a state in which the nozzle 52 is fittedinto the groove portion 58 a, the front end portion of the nozzle 52accesses the inside of the discharging portion 58.

The discharging portion 58 has a suction mechanism 58 b. As the suctionmechanism 58 b, for example, a suction pump or the like may be used. Thesuction mechanism 58 b is connected to the space communicated with thesoak solution storage portion 57 b of the soaking portion 57. When thesuction mechanism 58 b is operated, a discharge flow path 58 c in whichthe front end portion of the nozzle 52 is disposed and the soak solutionstorage portion 57 b are simultaneously suctioned.

The preliminary ejection portion 59 is a portion for performingpreliminary ejecting of the liquid material from the nozzle 52. Thepreliminary ejection portion 52 is disposed on the −Y direction side ofthe discharging portion 58, and is provided at a distance from thesoaking portion 57 and the discharging portion 58. The casing BD has agroove portion 59 a at a position corresponding to the preliminaryejection portion 59. The groove portion 59 a is a portion into which thenozzle 52 is fitted. The groove portion 59 a is formed to be broader insize along the Y direction than the groove portion 57 a and the grooveportion 58 a. In a state in which the nozzle 52 is fitted into thegroove portion 59 a, the front end portion of the nozzle 52 accesses thepreliminary ejection portion 59.

The preliminary ejection portion 59 includes a preliminary ejectionmember 59 b, a drain flow path 59 c, a drain mechanism 59 d, a suctionflow path 59 e, a suction mechanism 59 f, and a cleaning liquidsupplying mechanism 59 g. The drain flow path 59 c is a flow path formedin the −Z direction from the position at which the groove portion 59 ais provided. The liquid material ejected from the nozzle 52 partiallyflows in the drain flow path 59 c. The drain mechanism 59 d is a portionfor discharging the liquid material flowing in the −Z direction in thedrain flow path 59 c.

The suction flow path 59 e is a flow path which is connected to thedrain flow path 59 c, and branched in the −Y direction from the drainflow path 59 c. The suction mechanism 59 f is connected to the endportion on the −Y direction side of the suction flow path 59 e. As thesuction mechanism 59 f, for example, a suction pump or the like is used.When the suction mechanism 59 f is operated, the inside of the suctionflow path 59 e is suctioned.

The preliminary ejection member 59 b is a part receiving the liquidmaterial ejected from the nozzle 52. The preliminary ejection member 59b is provided in the suction flow path 59 e. The preliminary ejectionmember 59 b is a linear member formed along the direction of forming thesuction flow path 59 e (Y direction). As a material forming thepreliminary ejection member 59 b, a material may be used from a widevariety of materials such as metal materials and resin materials. Thepreliminary ejection member 59 b is provided to be movable in the Ydirection by a moving mechanism (not shown). Accordingly, when thepreliminary ejection member 59 b is moved, it is possible to cause theend portion on the +Y direction side of the preliminary ejection member59 b to protrude and draw back in the drain flow path 59 c. In a statein which the preliminary ejection member 59 b protrudes in the drainflow path 59 c, the ejecting direction of the liquid material of thenozzle 52 and the extending direction of the preliminary ejection member59 b are perpendicular to each other. The cleaning liquid supplyingmechanism 59 g is a part supplying a cleaning liquid to the preliminaryejection member 59 b. The cleaning liquid supplying mechanism 59 g ismounted, for example, on the −Z direction side of the suction flow path59 e, and is capable of supplying a cleaning liquid in the +Z direction.

The peripheral edge removing mechanism EBR is provided at a position onthe +X direction side of the coating mechanism CT along the −Y directionside edge of the substrate processing unit SPU. The peripheral edgeremoving mechanism EBR is a device which removes the thin film formed onthe peripheral edge of the substrate S. It is desirable that a removingprocess using the peripheral edge removing mechanism EBR be performed ina state where the thin film formed on the substrate S is not dried. Forthis reason, it is desirable that the peripheral edge removing mechanismEBR be disposed at a position capable of carrying the substrate S fromthe coating mechanism CT.

The peripheral edge removing mechanism EBR includes a dip portion, asuction portion, and a raising and lowering mechanism (not shown). Thedip portion is, for example, a portion which removes the thin filmformed on the peripheral edge of the substrate S in such a manner thatthe peripheral edge of the substrate S is dipped in the solution byrotating the substrate S so as to dissolve and remove the thin filmformed on the peripheral edge of the substrate S. The suction portion isa portion for suctioning the peripheral edge of the substrate S afterdipping in the solution of the dip portion. The raising and loweringmechanism is a moving mechanism which moves the dip portion and thesuction portion in the Z direction.

Substrate Unloading Unit

Returning to FIGS. 1 to 3, the substrate unloading unit ULU is disposedon the +X direction side of the substrate processing unit SPU in thesubstrate processing system SYS. The substrate unloading unit ULU is aunit which collects the unloading cassette C2 accommodating theprocessed substrate S and receives the empty unloading cassette C2. Thesubstrate unloading unit ULU is elongated in the Y direction, and iscapable of accommodating a plurality of unloading cassettes C2 arrangedin the Y direction.

The substrate unloading unit ULU includes a cassette entrance 60 and acassette moving mechanism (second moving mechanism) 61. The cassetteentrance 60 is an opening which is provided on the −Y direction side ofthe cover member covering the substrate unloading unit ULU. The cassetteentrance 60 is an inlet (supply opening) for the empty unloadingcassette C2, and an outlet (collection opening) for the unloadingcassette C2 accommodating the processed substrate S.

The cassette moving mechanism 61 includes, for example, a drivingmechanism such as a belt conveyor mechanism. In the embodiment, as thedriving mechanism, conveyor belts are provided. The conveyor beltsextend in the Y direction from the +Y direction side end portion of thesubstrate unloading unit ULU to the −Y direction side end portionthereof, where two conveyor belts are arranged in the X direction.

Among the two conveyor belts, the supply belt 61 a is a conveyor beltwhich is disposed on the −X direction side. The +Z direction sidesurface of the supply belt 61 a is used as a conveyor surface. Thesupply belt 61 a is adapted to rotate so that the conveyor surface movesin the +Y direction. The plurality of unloading cassettes C2, whichenter the substrate unloading unit ULU through the cassette entrance 60,are placed on the conveyor surface of the supply belt 61 a. Theunloading cassettes C2 are moved to the carrying unit CRU by therotation of the supply belt 61 a.

Among the two conveyor belts, the collection belt 61 b is a conveyorbelt which is disposed on the +X direction side. The +Z direction sidesurface of the collection belt 61 b is used as a conveyor surface. Thecollection belt 61 b is adapted to rotate so that the conveyor surfacemoves in the −Y direction. The plurality of unloading cassettes C2accommodating the processed substrates S are placed on the conveyorsurface of the collection belt 61 b. The unloading cassettes C2 areallowed to move to the cassette entrance 60 by the rotation of thecollection belt 61 b.

In the embodiment, for example, the unloading cassettes C2 are capableof staying in a standby state at standby positions (container standbyportion) provided at five positions on the supply belt 61 a and thecollection belt 61 b. In the substrate unloading unit ULU, it ispossible to move the standby position of the unloading cassette C2 byrotating the supply belt 61 a and the collection belt 61 b. It ispossible to shorten the carrying time of the unloading cassette C2 bymoving the standby position.

Carrying Unit

The carrying unit CRU is disposed in an area along the +Y direction sideedge inside the substrate processing system SYS, and is disposed so asto be adjacent to the substrate processing unit SPU, the substrateloading unit LDU, and the substrate unloading unit ULU. The carryingunit CRU carries the loading cassette C1 between the substrateprocessing unit SPU and the substrate loading unit LDU, and carries theunloading cassette C2 between the substrate processing unit SPU and thesubstrate unloading unit ULU. The carrying unit CRU includes a railmechanism RL and a cassette carrying device CC.

The rail mechanism RL is fixed onto the stage unit STU, and extends in alinear shape in the X direction from the −X-direction-side end portionof the carrying unit CRU to the +X-direction-side end portion thereof.The rail mechanism RL is a guiding mechanism which guides the movingposition of the cassette carrying device CC. The rail mechanism RLincludes two rail members 70 which are parallel in the Y direction.

The cassette carrying device CC is provided on two rail members 70 so asto be suspended on the two rail members 70 in plan view. The cassettecarrying device CC is a carrying device which accesses the buffermechanism BF of the substrate processing unit SPU, the substrate loadingunit LDU, and the substrate unloading unit ULU, and holds and carriesthe loading cassette C1 and the unloading cassette C2. The cassettecarrying device CC includes a movable member 71, a cassette supportplate 72, a support plate rotating mechanism 73, a cassette holdingmember 74, a holding member raising and lowering mechanism 75 (FIG. 3),and a holding member sliding mechanism 76 (FIG. 3).

The movable member 71 is formed in an H-shape in plan view, and includesconcave portions 71 a which are respectively fitted to two rail members70. The movable member 71 includes therein, for example, a drivingmechanism (a motor mechanism or the like) which is not shown in thedrawing. The movable member 71 is adapted to be movable in a linear areaalong the rail members 70 by the driving force of the driving mechanism.

The cassette support plate 72 is a plate-shaped member which is fixed tothe movable member 71 and is formed in a rectangular shape in plan view.The cassette support plate 72 is formed to have a dimension larger thanthat of the bottom portion of each of the loading cassette C1 and theunloading cassette C2, and is capable of stably placing the loadingcassette C1 and the unloading cassette C2 thereon. Since the cassettesupport plate 72 is fixed to the movable member 71, the cassette supportplate 72 moves together with the movable member 71.

The support plate rotating mechanism 73 is a rotary mechanism whichrotates the cassette support plate 72 in the XY plane where the Z axisserves as the rotary axis. The support plate rotating mechanism 73 iscapable of changing the longitudinal direction of each of the loadingcassette C1 and the unloading cassette C2 placed on the cassettecarrying device CC by rotating the cassette support plate 72.

The cassette holding member 74 is a holding member which is disposed onthe +Y direction side of the cassette support plate 72 in plan view andis formed in a U-shape in plan view. The cassette holding member 74 isprovided so that the X-direction position thereof overlaps with thecassette support plate 72. The cassette holding member 74 is supportedon the movable member 71 through a support member (not shown), and ismovable together with the movable member 71. Both end portions, formedin a U-shape, of the cassette holding member 74 are formed as a holdingportion 74 a which engages with the engagement portion Cx provided ineach of the loading cassette C1 and the unloading cassette C2. A gap ofthe holding portion 74 a (both end portions formed in a U-shape) in theX direction is adjustable in accordance with a gap of the engagementportion Cx provided in each of the loading cassette C1 and the unloadingcassette C2. The cassette holding member 74 is capable of furtherreliably holding the loading cassette C1 and the unloading cassette C2in the Z direction in such a manner that the holding portion 74 aengages with the engagement portion Cx.

The holding member raising and lowering mechanism 75 is a movingmechanism which is provided in the cassette holding member 74 and movesthe cassette holding member 74 in the Z direction. As the holding memberraising and lowering mechanism 75, for example, a driving mechanism suchas an air cylinder may be used. When the cassette holding member 74moves in the +Z direction by using the holding member raising andlowering mechanism 75, it is possible to lift the loading cassette C1and the unloading cassette C2 held by the cassette holding member 74. Onthe contrary, when the cassette holding member 74 moves in the −Zdirection by using the holding member raising and lowering mechanism 75,it is possible to place the lifted cassette in a desired position.

The holding member sliding mechanism 76 is a moving mechanism which isprovided in the cassette holding member 74, and moves the cassetteholding member 74 in the Y direction. The holding member slidingmechanism 76 includes a guide bar 76 b which extends in the Y directionand a movable member 76 a which moves along the guide bar 76 b. Themovable member 76 a is fixed to the cassette holding member 74. When themovable member 76 a moves in the Y direction along the guide bar 76 b,the cassette holding member 74 moves together with the movable member 76a in the Y direction.

Control Unit

The control unit CNU is provided in the stage unit STU of the substrateprocessing system SYS. The control unit CNU includes, for example, acontrol device which controls all operations in the respective units anda material supply source which supplies a material required for eachunit, where all operations include a substrate processing operation inthe substrate processing unit SPU, a cassette moving operation in thesubstrate loading unit LDU or the substrate unloading unit ULU, acarrying operation in the carrying unit CRU, and the like. The materialsupply source may be exemplified by, for example, a liquid materialsupply source, a cleaning liquid supply source, a soak solution supplysource, or the like.

Next, an operation of the substrate processing system SYS having theabove-described constitution will be described. The operations performedby the respective units of the substrate processing system SYS arecontrolled by the control unit CNU. In the below description, the unitperforming the operation is mainly described, but actually, theoperation is performed on the basis of the control of the control unitCNU.

Cassette Supply Operation

First, the cassette supply operation in which the loading cassette C1accommodating the unprocessed substrate S is disposed in the substrateloading unit LDU, and the empty unloading cassette C2 is disposed in thesubstrate unloading unit ULU will be described.

For example, by a supply device (not shown) or the like, the loadingcassette C1 accommodating the unprocessed substrate S is supplied to thesubstrate loading unit LDU through the cassette entrance 10. Thesubstrate loading unit LDU sequentially supplies the loading cassettesC1 while rotating the supply belt 11 a. By this operation, the pluralityof loading cassettes C1 accommodating the unprocessed substrates S arearranged inside the substrate loading unit LDU.

On the other hand, for example, by a supply device (not shown) or thelike, the empty unloading cassettes C2 are supplied to the substrateunloading unit ULU through the cassette entrance 60. The substrateunloading unit ULU allows the unloading cassettes C1 to sequentiallysupply while rotating the supply belt 11 a. By this operation, theplurality of unloading cassettes C2 accommodating the unprocessedsubstrates S are arranged inside the substrate unloading unit ULU.

Cassette Carrying Operation

Next, the cassette carrying operation in which the loading cassette C1supplied to the substrate loading unit LDU and the unloading cassette C2supplied to the substrate unloading unit ULU are respectively suppliedto the substrate processing unit SPU will be described. This cassettecarrying operation is performed using the cassette carrying device CCprovided in the carrying unit CRU.

The operation of carrying the loading cassette C1 will be described. Thecarrying unit CRU allows the cassette carrying device CC to access thesubstrate loading unit LDU, and transfers the loading cassettes C1 andmoves the cassette carrying device CC up to the loading buffer mechanismBF1. The carrying unit CRU moves the cassette carrying device CC, andplaces the loading cassettes C1 to the standby position P1 of theloading buffer mechanism BF1. After the transfer operation, thesubstrate loading unit LDU moves the supply belt 11 a, and moves therest of the loading cassettes C1 together in the +Y direction. Accordingto the movement of the loading cassettes C1, the space on the −Ydirection side on the supply belt 11 a becomes empty. Accordingly, a newloading cassette C1 is supplied to the empty space by a supply mechanism(not shown).

The operation of carrying the unloading cassette C2 is performed in thesame manner. That is, the carrying unit CRU allows the cassette carryingdevice CC to access the substrate unloading unit ULU, and transfers theunloading cassettes C2 and moves the cassette carrying device CC up tothe unloading buffer mechanism BF1. The carrying unit CRU moves thecassette carrying device CC, and places the unloading cassettes C2 inthe standby position P5 of the unloading buffer mechanism BF2. After thetransfer operation, the substrate unloading unit ULU moves the supplybelt 61 a, and moves the rest of the unloading cassettes C2 together inthe +Y direction. According to the movement of the unloading cassettesC2, the space on the −Y direction side on the supply belt 61 a becomesempty. Accordingly, a new unloading cassette C2 is supplied to the emptyspace by a supply mechanism (not shown).

Substrate Processing Operation

Next, a processing operation of the substrate processing unit SPU willbe described.

The substrate processing unit SPU performs a moving operation of movingthe loading cassette C1 accommodating the unprocessed substrate S andthe empty unloading cassette C2, a loading operation of loading thesubstrate S accommodated in the loading cassette C1, a coating operationof coating a liquid material on the substrate S, a peripheral edgeremoving operation of removing the peripheral edge of the thin filmformed on the substrate S, an unloading operation of unloading theprocessed substrate S, a moving operation of moving the empty loadingcassette C1 and the unloading cassette C2 accommodating the processedsubstrate S, a maintenance operation of maintaining a nozzle portion NZ,and a maintenance operation of maintaining a cup portion CP. In additionto the operations, the carrying operation of carrying the substrate S isperformed between the loading operation and the coating operation,between the coating operation and the peripheral edge removingoperation, and between the shape forming operation and the unloadingoperation.

Among these operations, first, the moving operation of the loadingcassette C1 and the unloading cassette C2 will be described. Thesubstrate processing unit SPU moves the loading cassette C1 carried tothe standby position P1 of the loading buffer mechanism BF1 to thestandby position P2 using the conveyor belt 20 a, and further moves theloading cassette C1 moved to the standby position P2 to the standbyposition P4 by using the conveyor belt 20 b. In the same manner, thesubstrate processing unit SPU moves the unloading cassette C2 carried tothe standby position P5 of the unloading buffer mechanism BF2 to thestandby position P6 using the conveyor belt 22 a, and further moves theunloading cassette C2 moved to the standby position P6 to the standbyposition P8 using the conveyor belt 22 b. According to these operations,the loading cassette C1 and the unloading cassette C2 carried to thesubstrate processing unit SPU are disposed at a process start position.

Next, the loading operation of the substrate S will be described. Afterthe substrate processing unit SPU checks that the loading cassette C1 isdisposed at the standby position P4, the substrate processing unit SPUdisposes the substrate upper portion holding mechanism 23 at theclamping position and moves the raising and lowering member 24 a of thesubstrate lower portion holding mechanism 24 in the +Z direction.According to the movement, the clamping member 24 b mounted to the +Zdirection side end portion of the raising and lowering member 24 a comesinto contact with the −Z direction side portion of one sheet ofsubstrate S disposed on the farthest −Y direction side among thesubstrate S accommodated in the loading cassette C1, and the −Zdirection side portion of the substrate S is held by the clamping member24 b.

After the −Z direction side portion of the substrate S is held, thesubstrate processing unit SPU moves further the raising and loweringmember 24 a in the +Z direction in the held state of the substrate S.According to the movement, the substrate S is lifted in the +Z directionside by the substrate lower portion holding mechanism 24, the +Zdirection side portion of the substrate S comes into contact with theclamping member 23 b of the substrate upper portion holding mechanism23, and then the +Z direction side portion of the substrate S is held bythe clamping member 23 b. The substrate S is held by both the clampingmember 23 b of the substrate upper portion holding portion 23 and theclamping member 24 b of the substrate lower portion holding mechanism24.

The substrate processing unit SPU simultaneously moves the raising andlowering members 23 a and 24 a in the +Z direction in a state where thesubstrate S is held by the clamping members 23 b and 24 b. The substrateprocessing unit SPU moves the raising and lowering mechanisms 23 c and24 c in an interlocking manner so that the raising and lowering members23 a and 24 a move at the same speed. The substrate S held by theclamping members 23 b and 24 b moves in the +Z direction. When thesubstrate S is disposed at the loading position LP, the substrateprocessing unit SPU stops the movement of the raising and loweringmembers 23 a and 24 a. In this manner, the loading operation of thesubstrate S is performed.

After the loading operation, the substrate processing unit SPU allowsthe holding portion 32 of the loading carrying mechanism SC1 to accessthe loading position LP, and allows the substrate S disposed at theloading position LP to be held by the holding portion 32. When theholding portion 32 accesses the loading position LP, the substrateprocessing unit SPU rotates the rotary table 30 b so that the front endsurface 31 b of the arm portion 31 faces the +Y direction, and drivesthe motor device 35 a so that the arm portion 31 moves in the Ydirection. In accordance with the movement of the arm portion 31, theholding portion 32 mounted to the front end surface 31 b of the armportion 31 accesses the loading position LP.

After the access of the holding portion 32, the substrate processingunit SPU operates the suction pump 34 a and the substrate S is held bysuction by the holding portion 32. By means of the operation, thesubstrate S is held by the holding portion 32 so as to be upright in theZ direction. In the substrate processing unit SPU, after the substrate Sis uprightly held by the holding portion 32, the holding force of theclamping members 23 b and 24 b is canceled so that the substrate S isheld by only the holding portion 32. In this state, the substrateprocessing unit SPU withdraws the clamping members 23 b and 24 b, ofwhich the holding force is canceled, in the −Z direction. After theclamping members 23 b and 24 b are withdrawn, the substrate processingunit SPU rotates the rotary table 30 b of the loading carrying mechanismSC1, and carries the substrate S to a coating position inside thecoating mechanism CT.

Next, the coating operation of coating the liquid material on thesubstrate S will be described. In the coating operation, the coatingmechanism CT is used. The substrate processing unit SPU rotates thesubstrate S at a high speed in the state where the substrate is uprightin the Z direction, allows nozzles 52 provided in the coating mechanismCT to access a coating position 50, and then ejects the liquid materialfrom the nozzles 52 to the substrate S.

In detail, the substrate processing unit SPU operates the motor device33 a in a state where the substrate S is disposed at the coatingposition 50. When the rotary shaft member 33 b rotates by the operationof the motor device 33 a, the holding portion 32 supported to the rotaryshaft member 33 b rotates together with the rotary shaft member 33 b.According to this operation, the substrate S rotates while the substrateS is upright in the Z direction.

After the substrate S rotates in the state where the substrate S isupright in the Z direction, the substrate processing unit SPU allows thenozzle 52 on the +X and −X direction sides of the coating position 50 toaccess the substrate S, and ejects the liquid material from the nozzle52 to the front and rear surfaces of the substrate S. The ejected liquidmaterial equally spreads to the outer periphery of the substrate S bythe centrifugal force caused by the rotation, thereby forming a thinfilm on both surfaces of the substrate S.

Since the nozzles 52 are disposed on the −Z direction side of the rotaryaxis of the substrate S, the nozzles 52 are disposed without contactingwith the holding portion 32 and the arm portion 31. In addition, sincethe nozzles 52 eject the liquid material from the rotary axis of thesubstrate S to the outer periphery of the substrate S, the movement ofthe liquid material toward the center of the substrate S is suppressed.

The substrate processing unit SPU may be configured to rotate an innercup CP1 upon coating the liquid material on the substrate S by rotatingthe substrate S.

In the case where the substrate processing unit SPU is configured torotate the inner cup CP1, as shown in FIG. 9, the inner cup CP1 isprovided with a rotary mechanism (second rotary mechanism) 53 c whichrotates the inner cup CP1 about the X axis serving as the rotary axis ina direction along the outer periphery of the substrate S.

Further, the discharging mechanism 54 is connected to the outer cup CP2,and the inner cup CP1 is provided with the opening 53 d.

Regardless of the rotation of the inner cup CP1, in the liquid materialejected onto the substrate S, due to the rotation of the substrate S,the liquid material protrudes and flows from the substrate S, and isaccommodated in an accommodation portion 53 through an opening formed ina facing portion 53 a of the inner cup CP1. In the inside of theaccommodation portion 53, due to the rotation of the substrate S, thestream of the liquid material and gas occurs in the rotation direction.In accordance with the stream, the liquid material and gas aredischarged to a discharge path through a discharging mechanism 54connected to an outer cup CP2. The liquid material and gas discharged tothe discharge path are divided by a trap mechanism 55, so that the gaspasses through the trap mechanism 55 and the liquid material remains inthe trap mechanism 55. The liquid material remaining in the trapmechanism 55 is discharged through a discharge portion (not shown).

After the coating operation, the substrate processing unit SPU makes theholding portion 42 of the unloading carrying mechanism SC2 access thesubstrate S inside the coating mechanism CT from the +X direction, andthe holding portion 42 holds the substrate S. The operation of holdingthe substrate S using the holding portion 42 is the same as that of thecase where the substrate S is held by the holding portion 32. Accordingto this operation, one surface of the substrate S is held by the holdingportion 32 of the loading carrying mechanism SC1 and the other surfaceof the substrate S is held by the holding portion 42 of the unloadingcarrying mechanism SC2.

After the substrate S is held by the holding portion 42, the substrateprocessing unit SPU stops the operation of the suction pump 34 a so asto cancel the holding operation using the holding portion 32. Accordingto this operation, since the substrate S is held by only the holdingportion 42 of the unloading carrying mechanism SC2, the substrate S isdelivered from the loading carrying mechanism SC1 to the unloadingcarrying mechanism SC2.

Next, the peripheral edge removing operation of removing the thin filmformed in the periphery of the substrate S will be described. In theperipheral edge removing operation, the peripheral edge removingmechanism EBR is used. After the delivery operation of the substrate S,the substrate processing unit SPU rotates a rotary table 40 b of theunloading carrying mechanism SC2 and appropriately expands or contractsan arm portion 41 so that the substrate S is disposed on the +Zdirection of the peripheral edge removing mechanism EBR. At this time,the substrate processing unit SPU carries the substrate S by theunloading carrying mechanism SC2 so that the substrate S is disposed atthe center in the Y direction of the dip portion.

After disposing the substrate S on the dip portion, the substrateprocessing unit SPU moves the dip portion and the suction portion to the+Z side using the raising and lowering mechanism and allows thesubstrate S to be dipped in the solution in the dip portion.Simultaneously, the substrate processing unit SPU brings the suctionportion close to the side of the substrate S side, to access thesubstrate S.

The substrate processing unit SPU operates a motor device 43 a of anunloading carrying mechanism SC2, and starts a suctioning operation ofthe suction portion. The rotary shaft member 43 b rotates by an actionof the motor device 43 a, and the suction member 46 held by the rotaryshaft member 43 b rotates together with the rotary shaft member 43 b.The thin film of the peripheral edge of the substrate S is removed bythe rotation. The portion where the thin film has been removed along theperipheral edge of the substrate S moves to the suction portion byrotation of the substrate S, and is then suctioned by the suctionportion. The liquid material and solution Q remaining at the peripheraledge of the substrate S are removed by the suctioning operation.

After rotating the substrate S for a predetermined amount of time, thesubstrate processing unit SPU stops the rotation of the substrate S, andstops the suctioning operation by the suction portion. The substrateprocessing unit SPU stops these operations, moves the dip portion andthe suction portion to the −Z side using the raising and loweringmechanism, and then cancels the dipping of the substrate S. In such amanner, the peripheral edge removing operation is performed.

After the peripheral edge removing operation, the substrate processingunit SPU moves the raising and lowering member 25 a so that the clampingmember 25 b of the substrate upper portion holding mechanism 25 islocated on the +Z direction side of the unloading position UP. After themovement of the raising and lowering member 25 a, the substrateprocessing unit SPU rotates the rotary table 40 b in the state where thesubstrate S is held by the holding portion 42 of the unloading carryingmechanism SC2, and appropriately expands or contracts the arm portion 41so that the holding portion 42 accesses the unloading position UP.According to this operation, the substrate S is disposed at theunloading position UP.

Next, the unloading operation of the substrate S will be described.After the substrate processing unit SPU checks that the substrate S isdisposed at the unloading position UP, the substrate processing unit SPUmoves the raising and lowering member 25 a of the substrate upperportion holding mechanism 25 in the −Z direction and the raising andlowering member 26 a of the substrate lower portion holding mechanism 26in the +Z direction. According to this movement, the clamping member 25b mounted to the −Z direction side portion of the raising and loweringmember 25 a comes into contact with the +Z direction side portion of thesubstrate S, and the clamping member 26 b mounted to the +Z directionside end portion of the raising and lowering member 26 a comes intocontact with the −Z direction side portion of the substrate S so thatthe +Z direction side portion and the −Z direction side portion of thesubstrate S are respectively held by the clamping members 25 b and 26 b.

After the substrate processing unit SPU checks that the substrate S isheld by both the clamping members 25 b and 26 b, the substrateprocessing unit SPU stops the operation of the suction pump 44 a of theunloading carrying mechanism SC2 so as to cancel the operation ofholding the substrate S using the holding portion 42. According to thisoperation, the substrate S is held by only the clamping members 25 b and26 b. The substrate processing unit SPU simultaneously moves the raisingand lowering members 25 a and 26 a in the −Z direction in the statewhere the substrate S is held by the clamping members 25 b and 26 b. Thesubstrate processing unit SPU moves the raising and lowering mechanisms25 c and 26 c in an interlocking manner so that the raising and loweringmembers 25 a and 26 a move at the same speed. The substrate S is movedin the −Z direction in the state where the substrate S is held by theclamping members 25 b and 26 b.

When the protrusion of the raising and lowering member 25 a approachesthe unloading cassette C2, the substrate processing unit SPU cancels theholding force using the clamping member 25 b and stops the movement ofthe raising and lowering member 25 a so that only the raising andlowering member 26 a moves in the −Z direction. The substrate S is movedin the −Z direction in the state where the substrate S is held by theholding force using the clamping member 26 b.

The substrate processing unit SPU maintains the operation of holding thesubstrate S using the clamping member 26 b until the substrate S arrivesat the accommodation position inside the unloading cassette C2. Afterthe substrate S arrives at the accommodation position, the substrateprocessing unit SPU cancels the holding operation using the clampingmember 26 b, and moves the raising and lowering member 26 a in the −Zdirection. According to this operation, the substrate S is accommodatedin the unloading cassette C2.

In the description of the respective operations, the respectiveoperations are sequentially performed on one sheet of substrate Saccommodated on the farthest −Y direction side of the loading cassetteC1, but actually, the respective operations are continuously performedon plural substrates S. In this case, the substrate processing unit SPUrotates the conveyor belt 20 b and moves the loading cassette C1 in the−Y direction so that the substrate S disposed on the farthest −Ydirection side of the rest of the substrates S accommodated in theloading cassette C1 is disposed at a position overlapping with theloading position LP in plan view.

In the same manner, the substrate processing unit SPU rotates theconveyor belt 22 b and moves the unloading cassette C2 in the −Ydirection so that the accommodation position on the farthest −Ydirection side of the accommodation positions inside the unloadingcassette C2 is disposed at a position overlapping with the unloadingposition UP in plan view. When the substrate processing unit SPU movesthe loading cassette C1 and the unloading cassette C2, the substrateprocessing unit SPU repeats the above-described operations.

In the case where plural substrates S are processed, the substrateprocessing unit SPU simultaneously performs the processing operations onthe plural substrates S. In detail, during the time when the coatingoperation is performed on a certain substrate S, the peripheral edgeremoving operation is performed on the other substrate S. In addition,the loading operation or the unloading operation is performed on anothersubstrate S. In this manner, the operations are simultaneously performedon the plural substrates S. Thus, since the process operations aresimultaneously performed, the standby time of the substrate S is reducedas much as possible, and hence the process takt time of the substrate Sis reduced.

In the case where the processes of all the substrates S accommodated inthe loading cassette C1 end, the loading cassette C1 is empty, and allaccommodation positions of the unloading cassette C2 staying at thestandby position P8 are filled with the processed substrates S. Afterthe substrate processing unit SPU checks this state, the substrateprocessing unit SPU moves the loading cassette C1 from the standbyposition P4 to the standby position P2 by rotating the conveyor belt 20b in the inverse direction, and moves the loading cassette C1 to thestandby position P3 by rotating the conveyor belt 20 a. In the samemanner, the substrate processing unit SPU moves the unloading cassetteC2 from the standby position P8 to the standby position P6 by rotatingthe conveyor belt 22 b in the inverse direction, and moves the unloadingcassette C2 to the standby position P7 by rotating the conveyor belt 22a.

Next, a maintenance operation of a nozzle portion NZ and a cup portionCP of the coating mechanism CT will be described with reference to FIG.15. When the coating operation is repeated, solidified materials such asa liquid material or impurities such as chips or dust in the atmospheremay be adhered to the nozzle portion NZ or the cup portion CP. Theimpurities may block, for example, the nozzles 52 to thereby deterioratethe ejecting characteristic thereof or may block the discharge pathinside the cup portion CP. In addition, in the ejecting operation, it isnecessary to constantly manage the ejecting condition of the nozzles 52.Accordingly, it is necessary to periodically perform the maintenanceoperation of the nozzle portion NZ and the cup portion CP.

In the maintenance operation of the nozzle portion NZ, a nozzle managingmechanism NM is used. Upon cleaning the nozzles 52, the substrateprocessing unit SPU moves the nozzle portion NZ so that the nozzlemanaging mechanism NM accesses the nozzles 52. As shown in FIG. 15A, inthe substrate processing unit SPU, the nozzle 52 is fitted into thegroove portion 57 a corresponding to the soaking portion 57. In a statein which the nozzle 52 is fitted into the groove portion 57 a, the frontend portion of the nozzle 52 is dipped in the soak solution Q in thesoak solution storage portion 57 b. Accordingly, the front end portionof the nozzle 52 is moisturized by the soak solution Q (the soakingprocess).

After the soaking process, the substrate processing unit SPU detachesthe nozzle 52 fitted into the groove portion 57 a, to move the nozzle 52to the discharging portion 58. As shown in FIG. 15B, the substrateprocessing unit SPU brings the moved nozzle 52 to be fitted into thegroove portion 58 a corresponding to the discharging portion 58. In astate in which the nozzle 52 is fitted into the groove portion 58 a, thefront end portion of the nozzle 52 is to be inserted into the dischargeflow path 58 c. In this state, the substrate processing unit SPUoperates the suction mechanism 58 b. By the operation of the suctionmechanism 58 b, the discharge flow path 58 c and the soak solutionstorage portion 57 b communicated with the discharge flow path 58 c aresuctioned (the suction process).

Due to this suction process, the front end portion of the nozzle 52 issuctioned, to dry the front end portion of the nozzle 52, and theimpurities adhered to the nozzle 52 are removed. At the same time, dueto this suctioning operation, the soak solution storage portion 57 b issuctioned, and the soak solution Q inside the soak solution storageportion 57 b moves to the discharge flow path 58 c, to be dischargedthrough the discharge flow path 58 c.

After the suctioning operation, the substrate processing unit SPUdetaches the nozzle 52 fitted into the groove portion 58 a, to move thenozzle 52 to the preliminary ejection portion 59. As shown in FIG. 15C,the substrate processing unit SPU brings the moved nozzle 52 to befitted into the groove portion 59 a corresponding to the preliminaryejection portion 59. The substrate processing unit SPU causes thepreliminary ejection portion 59 to perform a preliminary ejectingoperation of the nozzle 52 (the preliminary ejecting process).

In the preliminary ejecting process, the substrate processing unit SPUoperates the drain mechanism 59 d and the suction mechanism 59 f, andbrings the end portion on the +Y direction side of the preliminaryejection member 59 b of the preliminary ejection portion 59 to protrudeinto the drain flow path 59 c. In this state, the front end portion ofthe nozzle 52 and the preliminary ejection member 59 b are overlapped inplan view. Further, the extending direction (the Z direction) of thefront end portion of the nozzle 52 and the extending direction (the Ydirection) of the preliminary ejection member 59 b are perpendicular toeach other.

In this state, the substrate processing unit SPU preliminarily ejectsthe liquid material from the nozzle 52. Some of the liquid materialejected from the nozzle 52 touch the preliminary ejection member 59 bdisposed above the ejecting direction of the liquid material, to betransmitted through the preliminary ejection member 59 b to flow in the−Y direction. Since the inside of the suction flow path 59 e in whichthe preliminary ejection member 59 b is disposed is suctioned by thesuction mechanism 59 f, the liquid material is accelerated in the −Ydirection to reach the suction mechanism 59 f, to be discharged from thesuction mechanism 59 f. In such a manner, the preliminary ejectionmember 59 b receives some of the liquid material from the nozzle 52.

On the other hand, there is some of the liquid material ejected from thenozzle 52 which flows in the −Z direction inside the drain flow path 59c. This liquid material is to be discharged through the drain mechanism59 d.

After the liquid receiving process, the substrate processing unit SPUcleans the preliminary ejection member 59 b. In detail, a cleaningliquid is supplied from the cleaning liquid supplying mechanism 59 g tothe preliminary ejection member 59 b. The cleaning liquid supplied tothe preliminary ejection member 59 b is transmitted in the +Y directionand the −Y direction to flow through the preliminary ejection member 59b. Accordingly, the liquid material adhered to the preliminary ejectionmember 59 b is removed by the cleaning liquid, to clean the preliminaryejection member 59 b.

The substrate processing unit SPU continues the suctioning operation ofthe drain flow path 59 c and the suction flow path 59 e in cleaning ofthe preliminary ejection member 59 b. Accordingly, the cleaning liquidreaching the end portion on the +Y direction side of the preliminaryejection member 59 b is discharged from the drain mechanism 59 d throughthe drain flow path 59 c. Further, the cleaning liquid reaching the endportion on the −Y direction side of the preliminary ejection member 59 bis discharged from the suction mechanism 59 f.

After completion of the cleaning of the preliminary ejection member 59b, for example, the substrate processing unit SPU moves the preliminaryejection member 59 b in the −Y direction, to accommodate the preliminaryejection member 59 b in the suction flow path 59 e. The substrateprocessing unit SPU increases the suctioning force of the suctionmechanism 59 f after accommodating the preliminary ejection member 59 b.Since the suctioning pressure inside the suction flow path 59 e isincreased, the cleaning liquid adhered to the preliminary ejectionmember 59 b moves to the side of the suction mechanism 59 f. Due to thisoperation, the cleaning liquid adhered to the preliminary ejectionmember 59 b is discharged through the suction mechanism 59 f.

Due to the preliminary ejecting operation of the nozzle 52, the nozzle52 is ready for the ejecting operation.

The maintenance operation of the cup portion CP will be described. Uponcleaning the cup portion CP, cleaning liquid nozzle portions 56 areused. Upon performing the coating operation, the substrate processingunit SPU allows the cleaning liquid nozzle portions 56 instead of thenozzles 52 to access the +X-direction-side portion and the−X-direction-side portion of the substrate S while the substrate Srotates, and ejects the cleaning liquid from the cleaning liquid nozzleportions 56 to the substrate S. The cleaning liquid ejected onto thesubstrate S moves to the peripheral edge of the substrate S by thecentrifugal force caused by the rotation, and flows from the peripheraledge of the substrate S to the inner cup CP1. The flying cleaning liquidis accommodated in the accommodation portion 53 through the opening ofthe facing portion 53 a.

In such a manner, in the substrate processing unit SPU, the substrate Sis rotated regardless of the rotation of the inner cup CP 1. Due to thisoperation, it is possible to cause a stream of the cleaning liquid inthe accommodation portion 53, and it is possible to clean the inside ofthe accommodation portion 53 and the inside of the discharge path withthe stream of the cleaning liquid. As in the case of discharging theliquid material, the cleaning liquid is divided by the trap mechanism 55so as to be discharged separately from a gas.

The cleaning operation of the cup portion CP may be performed, forexample, in the state where the facing portion 53 a of the accommodationportion 53 is separated. Even in the case where the cleaning operationis not performed, for example, the facing portion 53 a may be separatedso as to separately clean the facing portion 53 a, or the facing portion53 a may be separated so as to perform the maintenance operation ofother portions of the cup portion CP.

Cassette Carrying Operation

Next, the cassette carrying operation in which the empty loadingcassette C1 is carried to the substrate loading unit LDU and theunloading cassette C2 accommodating the processed substrate S is carriedto the substrate unloading unit ULU will be described.

The operation of carrying the loading cassette C1 will be described. Thecarrying operation is performed by using the cassette carrying device CCused in the above-described carrying operation. The carrying unit CRUmoves the cassette carrying device CC up to the loading buffer mechanismBF1 of the substrate processing unit SPU, and allows the cassettecarrying device CC to perform the transfer operation of the emptyloading cassette C1 staying in a standby state at the standby positionP3.

After the transfer operation of the loading cassette C1, the carryingunit CRU moves the cassette carrying device CC in the −X directiontoward the substrate loading unit LDU. After the movement, the carryingunit CRU places the empty loading cassette C1 placed on the cassettesupport plate 72 on the +Y direction side end portion of the collectionbelt 11 b, and withdraws the cassette holding member 74 in the +Ydirection.

The operation of carrying the unloading cassette C2 will be described.The carrying operation is performed by using the cassette carryingdevice CC in the same manner as in the operation of carrying the loadingcassette C1. The carrying unit CRU moves the cassette carrying device CCup to the unloading buffer mechanism BF2 of the substrate processingunit SPU in the X direction, and allows the cassette carrying device CCto perform the transfer operation of the empty unloading cassette C2staying in a standby state at the standby position P7.

After the transfer operation, the carrying unit CRU moves the cassettecarrying device CC in the −X direction toward the substrate unloadingunit ULU. After the movement, the carrying unit CRU places the emptyunloading cassette C2 placed on the cassette support plate 72 on the +Ydirection side end portion of the collection belt 11 b, and withdrawsthe cassette holding member 74 in the +Y direction.

Cassette Collecting Operation

Next, a cassette collecting operation of collecting the empty loadingcassette C1 and the unloading cassette C2 accommodating the processedsubstrate S will be described.

After the substrate loading unit LDU checks that the empty loadingcassette C1 is carried thereto, the substrate loading unit LDU rotatesthe collecting belt 11 b so that the loading cassette C1 is carried tothe outside of the substrate loading unit LDU through the cassetteentrance 10. Whenever the loading cassette C1 is carried to thesubstrate loading unit LDU, this operation is repeated.

In the same manner, after the substrate unloading unit ULU checks thatthe unloading cassette C2 accommodating the processed substrate S iscarried thereto, the substrate unloading unit ULU rotates the collectingbelt 61 b, so that the unloading cassette C2 is moved in the −Ydirection and carried to the outside of the substrate unloading unit ULUthrough the cassette entrance 60. Whenever the unloading cassette C2 iscarried to the substrate unloading unit ULU, this operation is repeated.

Cassette Supplement Operation

After the carrying unit CRU checks that the standby positions P1 and P5are empty, the carrying unit CRU allows the cassette carrying device CCto carry the next loading cassette C1 and the unloading cassette C2 tothe standby positions P1 and P5, respectively. The carrying unit CRUfirst moves the cassette carrying device CC up to the substrate loadingunit LDU, and transfers the next loading cassette C1 thereto. After thetransfer operation, the carrying unit CRU moves the cassette carryingdevice CC up to the loading buffer mechanism BF1, and places thetransferred loading cassette C1 in the standby position P1. In the samemanner, the carrying unit CRU moves the cassette carrying device CC tothe substrate unloading unit ULU, and transfers the next unloadingcassette C2 thereto. Then, the carrying unit CRU moves the cassettecarrying device CC to the unloading buffer mechanism BF2, and places theunloading cassette C2 in the standby position P5.

When the loading cassette C1 moves from the standby position P1 to thestandby position P2, and the unloading cassette C2 moves from thestandby position P5 to the standby position P6, the standby positions P1and P5 become empty again. The next loading cassette C1 and the nextunloading cassette C2 may stay at the empty standby positions P1 and P5,respectively. Thus, whenever the standby positions P1 and P5 of theloading buffer mechanism BF1 and the unloading buffer mechanism BF2 areempty, the carrying unit CRU carries the loading cassette C1 from thesubstrate loading unit LDU and carries the unloading cassette C2 fromthe substrate unloading unit ULU.

As described above, according to the embodiment, since the nozzlemanaging mechanism NM includes the soaking portion 57 that dips thefront end of the nozzle 52 into the soak solution Q to clean the frontend of the nozzle 52, it is possible to reliably clean the front end ofthe nozzle 52. In addition, since the nozzle managing mechanism NMincludes the preliminary ejection portion 59 that receives the liquidmaterial preliminarily ejected from the nozzle 52, it is possible tomaintain the discharging state of the nozzle 52 proper. Accordingly, itis possible to maintain the discharging state of the nozzle 52 proper.Moreover, since the nozzle managing mechanism NM is provided with thesuction mechanism 58 b that suctions the front end of the nozzle 52, itis possible to remove foreign objects or the like adhered to the frontend of the nozzle 52, which makes it possible to keep the front end ofthe nozzle 52 clean.

In the embodiment, since the nozzle managing mechanism NM is mounted tothe cup portion CP, it is possible to cause the nozzle 52 to move fromthe coating operation position by the cup portion CP to each accessingposition of the nozzle managing mechanism NM in a short period of time.Moreover, since the discharging portion 58 is provided so as to beadjacent to the soaking portion 57, it is possible to efficientlydischarge the soak solution in the soaking portion 57. In addition,since it is easy to adjust a discharging rate of the soak solution fromthe discharging portion 58, a wide range of discharging modes in which asoak solution overflowing from the soaking portion 57 is discharged andthe like may be adopted.

In the embodiment, since the preliminary ejection portion 59 includesthe preliminary ejection member 59 b receiving the liquid materialpreliminarily ejected from the nozzle 52, and the preliminary ejectionmember 59 b is formed linearly, the preliminary ejection member 59 b iscapable of receiving the liquid material, not on its planar surface, buton its linear surface. Accordingly, it is possible to reliably receivethe liquid material regardless of an ejecting direction of the liquidmaterial. Further, since it suffices to provide the preliminary ejectionportion 59 be provided with the preliminary ejection member 59 b (alinear member) smaller in volume than the planar portion for receivingliquid, it is possible to suppress an increase in the size of thepreliminary ejection portion 59.

The technical scope of the invention is not limited to theabove-described embodiment, but may be appropriately modified intovarious forms without departing from the spirit of the invention.

For example, in the above-described embodiment, there is provided theconstitution in which the cleaning liquid nozzle portions 56 aredisposed as nozzles ejecting the cleaning liquid for cleaning the cupportion CP, but the invention is not limited thereto. For example, theabove-described nozzles 52 may be used to serve as, for example,cleaning liquid nozzles as well. In this case, a switching mechanism(not shown) which is capable of switching the supplying source of thenozzle 52 depending on a liquid material and a cleaning liquid, isprovided. Accordingly, it is possible to efficiently carry outmaintenance without complicating the constitution of the device.

Further, in the above-described embodiment, the nozzle portion NZ isdisposed at the position on the −Z direction side of the rotary axis ofthe substrate S, and the nozzle portion NZ is configured to eject theliquid material along the direction of gravitational force, but theinvention is not limited thereto. For example, the nozzle portion NZ maybe disposed at a position on the +Z direction side of the rotary axis ofthe substrate S, and the nozzle portion NZ may be configured to ejectthe liquid material opposite the direction of the gravitational force.

Further, in the above-described embodiment, the nozzle 52 is formed sothat it is bent at the bent portion 52 b, but the invention is notlimited thereto. For example, the nozzle 52 may be formed in a curvedform toward the −Z direction side of the rotary axis of the substrate S.Accordingly, it is possible to smoothen the circulation of the liquidmaterial.

Further, in the above-described embodiment, the nozzles 52 are disposedat the same positions of the front surface and the rear surface of thesubstrate S, but the invention is not limited thereto. For example, thenozzles 52 may be disposed at different positions as a position of thefront surface and a position of the rear surface. For example, relativeto the +X direction side of the coating position 50, the nozzle 52 maybe disposed on the −Z direction side of the rotary axis of the substrateS, and relative to the −X direction side of the coating position 50, thenozzle 52 may be disposed on the +Z direction side of the rotary axis ofthe substrate S. The positions on the +Z direction side and the −Zdirection side may, of course, be reversed.

Further, in the above-described embodiment, the nozzle managingmechanism NM is mounted to the cup portion CP, but the invention is notlimited thereto. The nozzle managing mechanism NM may be disposed atanother position within a range in which the nozzle managing mechanismNM is able to move.

Further, in the above-described embodiment, upon cleaning the inside thecup portion CP, the cleaning liquid is ejected onto the substrate S bythe cleaning liquid nozzle portions 56, but the invention is not limitedthereto. For example, a substrate for cleaning liquid ejection which isdifferent from the substrate S may be disposed at the coating position50, and the cleaning liquid may be ejected onto the substrate forcleaning liquid ejection. Accordingly, it is possible to reduceconsumption of the substrate S except for the use for forming a thinfilm.

Further, in the above-described embodiment, the substrate carryingmechanisms SC are provided at the two positions in the substrateprocessing unit SPU, but the invention is not limited thereto. Forexample, the substrate carrying mechanism SC may be disposed at oneposition, or the substrate carrying mechanisms SC may be disposed atthree or more positions.

Further, in the above-described embodiment, the description of theconstitution in which the substrate loading unit LDU includes the beltconveyor mechanism as the moving mechanism 11 has been made as anexample, but the invention is not limited thereto. The substrate loadingunit LDU may include a fork member that holds the engagement portion Cxof the loading cassette C1 in addition to the belt conveyor mechanism.This fork member may be formed in the same way as, for example, thecassette holding member 74 of the cassette carrying device CC. The forkmember may be configured to hold the engagement portion Cx of theloading cassette C1 to move in the substrate loading unit LDU. The forkmember may be used as the cassette moving mechanism 61 of the substrateunloading unit ULU.

Further, in the above-described embodiment, conveyor belts 20 a, 20 b,22 a, and 22 b have been described as examples of mechanisms for movingthe standby positions of the loading cassette C1 and the unloadingcassette C2 in the loading buffer mechanism BF1 and the unloading buffermechanism BF2, but the present invention is not limited thereto. Forexample, the loading buffer mechanism BF1 may be provided with a movingmechanism for moving the loading cassette C1 to the standby position P1,the standby position P2, the standby position P4, the standby positionP2, and the standby position P3 in series. In the same way, theunloading buffer mechanism BF2 may be provided with a moving mechanismfor moving the unloading cassette C2 to the standby position P5, thestandby position P6, the standby position P8, the standby position P6,and the standby position P7 in series. Such moving mechanisms, may beexemplified, for example, by a constitution with fork members holdingthe engagement portions Cx of the loading cassette C1 and the unloadingcassette C2. This fork member may be formed in the same way as, forexample, the cassette holding member 74 of the cassette carrying deviceCC.

Further, in the above-described embodiment, the loading carryingmechanism SC1 holds the substrate S to rotate the substrate S, but thepresent invention is not limited thereto. For example, the loadingcarrying mechanism SC1 and the unloading carrying mechanism SC2 may beconfigured to sandwich the front surface and the rear surface of thesubstrate S to rotate the substrate S. In this case, one of the loadingcarrying mechanism SC1 and the unloading carrying mechanism SC2 may beself-driven to rotate, and the other one of the loading carryingmechanism SC1 and the unloading carrying mechanism SC2 may be driven torotate, or both of them may be self-driven to rotate. When the frontsurface and the rear surface of the substrate S are held by the loadingcarrying mechanism SC1 and the unloading carrying mechanism SC2, it ispossible to equalize the air currents and the like on the front surfaceside and the rear surface side of the substrate S as much as possible.When the states on the both surface sides of the substrate S areadjusted, it is possible to prevent the qualities of the films coated onthe both surfaces of the substrate S from differing from each other.

Further, in the above-described embodiment, the peripheral edge removingmechanism EBR is provided only on the side of the unloading carryingmechanism SC2, but the present invention is not limited thereto. Forexample, the peripheral edge removing mechanism EBR may be provided onthe side of the loading carrying mechanism SC1 as well (the portion ofthe dashed line in FIG. 1). With this constitution, for example, it ispossible to cause the both of the loading carrying mechanism SC1 and theunloading carrying mechanism SC2 to perform a coating operation and aperipheral edge removing operation respectively.

For example, while the loading carrying mechanism SC1 is caused toperform a coating operation, it is possible to cause the unloadingcarrying mechanism SC2 to perform a peripheral edge removing operation.Reversely, while the loading carrying mechanism SC1 is caused to performa peripheral edge removing operation, it is possible to cause theunloading carrying mechanism SC2 to perform a coating operation. In sucha manner, since the two substrate loading devices SC are alternatelymade to access the coating device CT, which makes it possible to performparallel processes, efficient processing is possible, which makes itpossible to make an attempt to further shorten the total process takttime.

Further, as described above, when the loading carrying mechanism SC1 andthe unloading carrying mechanism SC2 are configured to simultaneouslyhold the substrate S to rotate the substrate S, the inside of theperipheral edge removing mechanism EBR may be provided in the coatingdevice CT. With this constitution, the coating operation is performed inthe state where the substrate S is held and rotated by each of theloading carrying device SC1 and the unloading carrying device SC2, andthe peripheral edge removing operation is continuously performed afterthe coating operation. Accordingly, since the coating operation and theperipheral edge removing operation are performed by one device, it ispossible to improve the efficiency of the process. In addition, sincethe coating operation and the peripheral edge removing operation areperformed by one coating device CT, for example, after performing thecoating operation and the peripheral edge removing operation on onesheet of substrate S, the next substrate S to be processed can be loadedby the loading carrying device SC1 in the state where the one sheet ofsubstrate S is unloaded by the unloading carrying device SC2. Since itis possible to simultaneously perform the loading operation using theloading carrying device SC1 and the unloading operation using theunloading carrying device SC2, it is possible to efficiently perform theprocess operation.

In the above-described embodiment, the cassette moving mechanisms 20, 22are described as the belt conveyor mechanism in the loading buffermechanism BF1 and the unloading buffer mechanism BF2, but the presentinvention is not limited thereto. For example, as shown in FIG. 16, thecassette C may be carried by the arm mechanism.

FIG. 16 is a view which corresponds to FIG. 1 in the above-describedembodiment and shows a constitution of cassette moving mechanisms 20,22. FIG. 17 is an enlarged view of the cassette moving mechanism 20 ofFIG. 16. FIG. 18 is a view showing a partial constitution of thecassette moving mechanism 20. FIG. 19 is a view showing the state whenthe cassette moving mechanism 20 is viewed in the +Y direction. Sincethe cassette moving mechanism 20 has the same constitution as that ofthe cassette moving mechanism 22, the description is mainly made by wayof the cassette moving mechanism 20. FIGS. 17 and 18 show the standbypositions P1 to P4 corresponding to the standby position P5 to P8.

As shown in FIGS. 16 to 18, the cassette moving mechanism 20 includes acassette placing member 20 a and a cassette carrying arm 20 b. Thecassette placing member 20 a is a plate-shaped member providedrespectively at the standby positions P1 to P3. On the +Z side surfaceof the cassette placing member 20 a, a loading cassette C1 is placed.

As shown in FIGS. 16 and 17, the cassette placing member 20 a providedat the standby position P2 is movable in the Y direction by the drivingportion (not shown). Therefore, the cassette placing member 20 aprovided at the standby position P2 is removable between the standbyposition P2 and the standby position P4 by the driving portion. Thecassette placing member 20 a provided at the standby positions P1 and P3is in the fixed state.

As shown in FIGS. 17 and 19, on the +Z side surface (placing surface) ofthe cassette placing member 20 a, the ring-shaped convex portion 20 c isformed along the outer periphery of the loading cassette C1. Byproviding this convex portion 20 c, the loading cassette C1 is fittedinto the convex portion 20 c in the state where the loading cassette C1is placed on the cassette placing member 20 a. Therefore, it becomespossible to perform positioning of the loading cassette C1 and toprevent the positional deviation of the loading cassette C1.

The cassette carrying arm 20 b is provided at two positions of thestandby positions P1 to P3. The cassette carrying arm 20 b is formedalong the outer periphery of the cassette placing member 20 a in the Zdirection view. The cassette carrying arm 20 b is provided movably inthe X and Z directions by the driving portion (not shown). As shown inFIG. 18, the cassette carrying arm 20 b is in the state of being fixedand supported by the arm supporting member 20 d. To the arm supportingmember 20 d, the driving mechanism (not shown) is connected. The drivingmechanism (not shown) forms the arm supporting member 20 d movably inthe X and Z directions. The cassette carrying arm 20 b is movabletogether with the movement of the arm supporting member 20 d. As shownin FIG. 19, the cassette carrying arm 20 b is provided movably on the +Zside and the −Z side of the cassette placing member 20 a.

Next, an operation of the cassette moving mechanism 20 with theabove-described constitution will be described. While the operation isrepresentatively described by way of the cassette moving mechanism 20 inthe following description of the operation, a similar operation isperformed with respect to the cassette moving mechanism 22.

The substrate processing unit SPU moves the cassette carrying arm 20 bfrom the −Z side to the +Z side of the cassette placing member 20 a inthe state where the loading cassette C1 is placed on the cassetteplacing member 20 a provided at the standby position P1. By thisoperation, the cassette carrying arm 20 b receives the loading cassetteC1, resulting in the state where the loading cassette C1 is lifted fromthe cassette placing member 20 a.

The substrate processing unit SPU moves the cassette carrying arm 20 breceiving the loading cassette C1 in the +X direction, and then stopsthe movement at the standby position P2. After stopping the movement,the substrate processing unit SPU moves the cassette carrying arm 20 bin the Z direction of the cassette placing member 20 a. By thisoperation, the cassette carrying arm 20 b delivers the loading cassetteC1 to cassette placing member 20 a, and the cassette carrying arm 20 bmoves to the −Z side of the cassette placing member 20 a.

The substrate processing unit SPU moves the cassette carrying arm 20 bto the −Z side of the cassette placing member 20 a, and then moves thecassette carrying arm 20 b in the −X direction. By this operation, thecassette carrying arm 20 b returns to the original position (standbyposition P1). Simultaneously, the substrate processing unit SPU movesthe cassette carrying arm 20 b disposed at the standby position P3 inthe X direction. By this operation, the cassette carrying arm 20 b isplaced on the −Z side of the cassette placing member 20 a at the standbyposition P2.

The substrate processing unit SPU performs an operation of moving thecassette placing member 20 a to the standby position P4 from the statewhere the loading cassette C1 is placed on the cassette placing member20 a at the standby position P2. By the operation, the loading cassetteC1 moves from the standby position P2 to the standby position P4. Inthis case, the cassette carrying arm 20 b disposed at the standbyposition P2 does not move, and only the cassette placing member 20 amoves to the standby position P2. After processing the substrate S atthe standby position P4, the substrate processing unit SPU moves thecassette placing member 20 a from the standby position P4 to the standbyposition P2. By this operation, the loading cassette C1 is returned tothe standby position P2.

The substrate processing unit SPU moves the cassette carrying arm 20 bdisposed newly at the standby position P2 on the +X side in the drawingin the +Z direction, to cause the cassette carrying arm 20 b to receivethe loading cassette C1. After the substrate processing unit SPU causesthe cassette carrying arm 20 b to receive the loading cassette C1, thesubstrate processing unit SPU moves this cassette carrying arm 20 b inthe +X direction, and then stops the movement at the standby positionP3. After stopping the movement, the substrate processing unit SPU movesthe cassette carrying arm 20 b in the −Z direction, and places theloading cassette C1 on the cassette placing member 20 a of the standbyposition P3.

As described above, the substrate processing unit SPU moves the cassettecarrying arm 20 b disposed on the −X side in the drawing between thestandby position P1 and the standby position P2, and moves the cassettecarrying arm 20 b disposed on the +X side in the drawing between thestandby position P2 and the standby position P3. By this operation, itis possible to separately carry the loading cassette C1 disposed at thestandby position P1 and the loading cassette C1 disposed at the standbyposition P2.

The substrate processing unit SPU moves the cassette placing member 20 adisposed at the standby position P2 between the standby position P2 andthe standby position P4. By this operation, it is possible to move theloading cassette C1 carried to the standby position P2 to the standbyposition P4, and to return the loading cassette C1 at the standbyposition P4 to the standby position P2.

Further, in the above-described embodiment, the description of the modein which the preliminary ejection portion 59 performs a preliminaryejecting operation of the nozzle 52, has been made as an example, butthe present invention is not limited thereto. For example, it may be amode in which the nozzle 52 is connected to the discharging portion 58to perform a preliminary ejecting operation.

For example, the nozzle 52 after an ejecting operation onto thesubstrate P is dipped in the soak solution Q in the soaking portion 57.In the case where a preliminary ejecting operation is performed, thenozzle 52 is raised from the soak solution, and the nozzle 52 is fittedinto the groove portion 58 a of the discharging portion 58. In thisstate, for example, the liquid material is preliminarily ejected fromthe nozzle 52 without operating the suction mechanism 58 b. Thepreliminary ejected liquid materials is discharged via the dischargeflow path 58 c.

In such a manner, when a preliminary ejecting operation of the nozzle 52is performed by the discharging portion 58 without using the preliminaryejection portion 59, it is possible to shorten a takt time. Further,since the discharging portion 58 serves as both a discharging portionfor the soak solution Q and a discharging portion for the liquidmaterial, it is possible to unify the management of the dischargingportion 58, which makes it possible to shorten a takt time for theentire processes.

In addition, in this case, it is preferable that a liquid which is thesame as the liquid material ejected from the nozzle 52 is used as a soaksolution Q. In such a manner, since the soak solution Q and the liquidmaterial of the same kind of liquids are discharged from the dischargingportion 58, it is possible to more efficiently manage the dischargeliquid from the discharging portion 58.

Further, regarding a preliminary ejecting operation, it may be a mode inwhich, for example, the soaking portion 57 performs a preliminaryejecting operation. In this case, first, the nozzle 52 after apreliminary ejecting operation onto the substrate S is dipped in thesoak solution Q in the soaking portion 57. In the case where apreliminary ejecting operation is performed, the nozzle 52 is raisedfrom the soak solution, and the liquid material is preliminarily ejectedfrom the nozzle 52 in a state in which the nozzle 52 is not dipped inthe soak solution. The preliminarily ejected liquid material is storedin the soak solution storage portion 57 b. The liquid material stored inthe soak solution storage portion 57 b may be discharged from thedischarging portion 58 as needed by, for example, operating the suctionmechanism 58 b.

In such a manner, when the soaking portion 57 performs a preliminaryejecting operation of the nozzle 52, it is possible to further shorten atakt time for the entire processes. Further, since the liquid materialused for preliminary ejecting may be used as a new soak solution Q,there is an advantage that it is possible to reduce consumption of thesoak solution Q (liquid material).

In addition, in this case as well, a liquid which is the same as theliquid material ejected from the nozzle 52 may be used as a soaksolution Q. In such a manner, the liquid material stored in the soaksolution storage portion 57 may be used as a soak solution Q in whichthe front end of the nozzle 52 is dipped. Moreover, since the soaksolution Q and the liquid material of the same kind of liquids aredischarged from the discharging portion 58, it is possible to moreefficiently manage the discharge liquid from the discharging portion 58.

What is claimed is:
 1. A coating device comprising: a coating mechanismwhich includes nozzles having a bent portion, wherein the nozzles areconfigured to eject a liquid material onto front and rear surfaces of asubstrate while rotating the substrate disposed in an upright state; anda nozzle managing mechanism which manages the state of at least one ofthe nozzles, wherein the nozzle managing mechanism includes: a soakingportion which dips a front end of the at least one of the nozzles in asoak solution, and a discharging portion which discharges at least thesoak solution.
 2. The coating device according to claim 1, wherein thenozzle managing mechanism is provided in the vicinity of the coatingmechanism.
 3. The coating device according to claim 1, wherein thecoating device includes a cup portion, and the nozzle managing mechanismis mounted to the cup portion.
 4. The coating device according to claim1, wherein the discharging portion includes a connection portion towhich the front end of one of the nozzles is connected.
 5. The coatingdevice according to claim 1, wherein the discharging portion includes asuction portion.
 6. The coating device according to claim 1, wherein thedischarging portion is provided so as to be adjacent to the soakingportion.
 7. The coating device according to claim 1, wherein the nozzlemanaging mechanism includes at least a movement restricting portion thatrestricts a movement of the at least one of the nozzles in a state inwhich one of the nozzles is connected to the soaking portion.
 8. Thecoating device according to claim 7, wherein the movement restrictingportion includes a groove portion into which the front end of the atleast one of the nozzles is fitted.
 9. The coating device according toclaim 1, wherein the soaking portion includes a soak solution storageportion storing the soak solution, and the soak solution storage portionis formed so as to become narrower gradually in the depth direction. 10.The coating device according to claim 1, wherein the nozzle managingmechanism includes a preliminary ejection portion that receives theliquid material preliminarily ejected from the at least one of thenozzles, and the preliminary ejection portion includes a linear memberthat receives the liquid material preliminarily ejected from the atleast one of the nozzles.
 11. The coating device according to claim 10,wherein the linear member is disposed so as to intersect with theejecting direction of the liquid material.
 12. The coating deviceaccording to claim 10, wherein the linear member is provided so as to becapable of drawing back from the front end of the at least one of thenozzles.
 13. The coating device according to claim 10, wherein thepreliminary ejection portion includes a suction portion that suctions asurrounding space of the linear member.